Silicone thermal pad with self‑adhesive backing, 120 mm by 20 mm and 1.5 mm thick, delivers 8 W/m·K conductivity across a wide temperature range from –100 °C to +250 °C, ideal for heat spreaders on CPUs or GPUs.
Self-adhesive, thermally conductive silicone pad for computer or console cooling, 100x100x1mm, conducts heat to cool heating elements.
Silicone thermal pad, 120 × 20 × 2 mm, self‑adhesive and electrically non‑conductive, delivers 8 W/mK heat transfer while compressing to fill gaps on CPUs, GPUs or SSDs, operating from –100 °C to +250 °C.
Silicone thermal pad with 8 W/mK conductivity, self‑adhesive, 100 mm square and 2 mm thick, ideal for CPU, GPU or console heat spreaders, operating from –100 °C to +250 °C.
Silicone thermal pad, self-adhesive and thermally conductive, designed to cool computer or console heating elements with high performance and efficient heat conduction.
Silicone thermal pad for computer and console cooling, self-adhesive and thermally conductive for efficient heat transfer and cooling performance.
Thermal Grizzly Kryonaut is a high-performance thermal paste for cooling CPU and GPU, with 5.5 grams or 1.5 ml of product.
Thermal Grizzly Conductonaut is a high-performance liquid metal thermal compound paste in 1 gram. It efficiently reduces heat between components such as CPU and GPU for improved cooling performance.
Although the proportion of metal elements compared to other products in the Grizzly Thermal range is slightly lower, the Aeronaut provides a reliable and high performance thermal compound that is ideal for system builders looking f
Although the proportion of metal elements compared to other products in the Grizzly Thermal range is slightly lower, the Aeronaut provides a reliable and high performance thermal compound that is ideal for system builders looking f
(4044953501074 / XZ019)
Grey thermal paste in a convenient polybag, 4 g of high‑conductivity compound (7.2 W/m·K) that fills microscopic gaps for superior heat transfer between CPU and cooler, ensuring stable performance.
Cleaning wipes for removing thermal compounds such as Noctua NT-H2 and NT-H1 - Ideal for cleaning the contact surface of the heatsink as well as the heat-spreader of CPUs, GPUs or other chips - Pre-moistened with a custom detergent mixture for easy and ef
Experience efficient cooling with the LC POWER LC-TG-4G thermal compound. This high-performance thermal paste provides optimal heat transfer at 4 W/m·K and comes in a convenient 4g package for easy application.
High-performance thermal paste for efficient heat transfer, with 13 W/m·K thermal conductivity and 3.5g capacity.
Thermal pad with 13 W/mk thermal conductivity, 80x40x1.5 mm dimensions, for efficient heat transfer and management.
Discover the Iceberg Thermal ICT 71352 - DRIFT thermal pad: a high-performance solution with 13 W/mk conductivity, ideal for efficient heat dissipation in electronic devices. Measuring 80x40x2.0 mm, it ensures optimal thermal management and reliability.
High-performance LC POWER LC-TG-1G thermal paste (1 g) with excellent conductivity of 4 W/m·K. Perfect for efficient heat dissipation in CPUs and GPUs, ensuring optimal system performance. Ideal choice for enhancing cooling solutions.
