Electronics Engineering (Height 130 mm)
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Height 130 mm
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LCR meter RF module ADC module Breadboard DAC module FPGA board GPS module LCD module NFC module SoM module Arduino Uno LoRa module OLED module WiFi module Arduino Mega ESP32 module Oscilloscope Arduino board ESP8266 module Logic analyzer Soldering iron BeagleBone Black Bluetooth module Desoldering pump Gyroscope module Raspberry Pi Pico Soldering station Spectrum analyzer Voltage regulator Digital multimeter Function generator Raspberry Pi board Accelerometer module Benchtop power supply Microcontroller board Operational amplifier Printed circuit board RF transceiver module SoC development board FPGA development board
Explore how thin films deform, crack, and evolve on a microscopic level with this comprehensive guide to stress mechanics, defect dynamics, and surface morphology in advanced materials.
(9781785480539)
Springer-Verlag New York Inc. (9781461435228 / 118 black & white illustrations, 660 col)
(9780077221300)
(9781449310561 / 9781449310561) - Dimensions: 14.7cm x 21.6cm - ISBN: 9781449310561 - Publish date: 02/03/2012