High‑performance thermal interface material in a compact 24 mm × 12 mm size, featuring graphene‑enhanced conductivity and a 0.2 mm thickness for efficient heat transfer between components.
High‑performance thermal interface material in a compact 24 mm × 12 mm size, featuring graphene‑enhanced conductivity and a 0.2 mm thickness for efficient heat transfer between components.
High‑performance thermal interface material in a compact 24 mm × 12 mm size, featuring graphene‑enhanced conductivity and a 0.2 mm thickness for efficient heat transfer between components.
High-performance graphene-enhanced thermal pad, 50 × 50 mm with 0.2 mm thickness, designed for efficient heat transfer between components and heatsinks in electronics.
High-performance graphene-enhanced thermal pad, 50 × 50 mm with 0.2 mm thickness, designed for efficient heat transfer between components and heatsinks in electronics.
High-performance graphene-enhanced thermal pad, 50 × 50 mm with 0.2 mm thickness, designed for efficient heat transfer between components and heatsinks in electronics.
