Intel Xeon E5-2687W v4 - 3.0GHz Twelve Core Socket 2011-v3 Processor

Intel (0735858310901 / BX80660E52687V4) - Box - ECC - Enhanced intel speedstep technology - Execute disable bit - Idle states - Intel 64 - Intel Demand Based Switching - Intel enhanced halt state - Intel trusted execution technology

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Intel Xeon E5-2687W v4 – 3.0 GHz Twelve‑Core Server Processor

The Intel Xeon E5-2687W v4 is a high‑performance, single‑socket workstation and server CPU built on Intel’s 14 nm Broadwell architecture. Designed for demanding workloads such as virtualization, database management, scientific computing, and media rendering, this processor delivers exceptional throughput with its twelve cores and twenty‑four threads.

Core Architecture & Performance

The chip features 12 physical cores, each capable of running two simultaneous threads via Intel Hyper‑Threading Technology, for a total of 24 logical processors. The base frequency is set at 3.0 GHz, with an optional boost up to 3.5 GHz under load, ensuring rapid response times and efficient multitasking.

All cores share a massive 30 MB Smart Cache, which dramatically reduces memory latency and improves data locality for compute‑intensive applications. The cache hierarchy is engineered to keep frequently accessed data close to the execution units, thereby maximizing instruction throughput.

Memory & I/O Capabilities

The processor supports quad‑channel DDR4‑SDRAM, with memory speeds ranging from 1600 MHz up to 2400 MHz. This configuration allows for high bandwidth and low latency, essential for workloads that require rapid data access.

With a maximum of 40 PCI Express lanes available via two QPI links, the Xeon E5-2687W v4 can accommodate multiple GPUs, NVMe SSDs, or other high‑throughput peripherals. The integrated QPI (QuickPath Interconnect) bus operates at 9.6 GT/s, providing fast communication between sockets in dual‑socket systems.

Thermal Design & Power Management

The CPU’s thermal design power (TDP) is rated at 160 W. It incorporates advanced Intel power management features such as Intel Demand Based Switching, Enhanced Intel SpeedStep Technology, and Intel Flexible Memory Access to dynamically adjust performance and power consumption based on workload demands.

The processor’s case temperature (Tcase) is maintained at a maximum of 76 °C, ensuring reliable operation under sustained load. Although the package does not include an integrated cooler, it is compatible with a wide range of third‑party cooling solutions designed for LGA 2011‑v3 sockets.

Security & Reliability Features

The Xeon E5-2687W v4 incorporates several security and reliability technologies:

Intel Trusted Execution Technology (TXT) – protects the system against firmware attacks by ensuring a trusted boot environment.
Intel Software Guard Extensions (SGX) with Transactional Synchronization Extensions (TSX‑NI) – enables secure enclaves and efficient lockless synchronization for critical code paths.
Execute Disable Bit – prevents execution of non‑executable memory regions, mitigating buffer overflow exploits.
ECC Memory Support – detects and corrects single-bit errors in data stored in RAM, enhancing system stability for mission‑critical applications.
Intel Identity Protection Technology (IPT) – provides hardware‑based protection against side‑channel attacks.

Instruction Set & Software Compatibility

The processor supports the full set of modern Intel instruction sets, including AVX2, SSE4.1/4.2, and Intel 64. This ensures compatibility with a wide range of operating systems (Windows Server, Linux distributions, VMware ESXi) and software suites that leverage vectorized operations for performance gains.

Physical Package & Form Factor

The CPU is packaged in an LGA 2011‑v3 socket, measuring 45 mm × 52.5 mm, with a height of 44 mm and depth of 101 mm. The package dimensions are optimized for high‑density server motherboards while maintaining robust thermal pathways.

Scalability & Deployment Scenarios

Designed for single‑socket deployments, the Xeon E5-2687W v4 excels in environments where a powerful, compact compute node is required. Its 2S scalability feature allows it to be paired with another compatible processor in dual‑socket systems, effectively doubling core count and memory capacity while preserving high bandwidth interconnects.

Typical deployment scenarios include:

Virtualization Hosts – running multiple virtual machines with high CPU and memory demands.
Database Servers – handling large transactional workloads with low latency requirements.
High‑Performance Computing (HPC) – executing parallel scientific simulations that benefit from multi‑core throughput.
Media & Content Creation Workstations – accelerating rendering pipelines and real‑time editing tasks.

Conclusion

The Intel Xeon E5-2687W v4 delivers a compelling blend of raw compute power, memory bandwidth, and advanced security features in a single‑socket form factor. Its 12 cores, 24 threads, and 30 MB Smart Cache make it an ideal choice for workloads that demand sustained high performance, while its robust I/O and thermal design ensure reliability in demanding server or workstation environments.

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Tags	Processor Xeon processor V4 processor Socket 2011-v3 processor Twelve core processor 30mb cache processor 3ghz processor 2011-v3 socket processor 160w processor 3.0ghz processor 12-core cpu processor Processor 3.0ghz Processor twelve core Processor socket 2011-v3 Processor xeon e5-2687w v4 Processor sr2na xeon Processor 30m cache Processor 12-core cpu Processor bx80660e52687v4 Processor 160w Processor xeon e5-2687wv4 Processor 3.00ghz Processor 30mb cache Processor twelve core cpu Processor socket 2011-v3 processor
Identifiers
Brand	Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.
Model	Intel BX80660E52687V4
MPN	Intel BX80660E52687V4
ID	1955684
Dimensions / Weight
Key Features
Box Indicates whether a product is supplied in a closed box or container. A value of "Yes" means the item comes with protective packaging; a value of "No" indicates it does not.	Yes
Bus bandwidth The maximum frequency at which a system bus can transfer data, expressed in hertz (Hz). It indicates the theoretical throughput capability of the bus and allows users to compare performance across different processors or components.	9.6
Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.	QPI
Bus type units The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.	GT/s
Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.	Server/Workstation
Cooler included Indicates whether the product comes with a cooling solution included in its package. A value of "Yes" means a cooler (air, liquid, or passive) is supplied; a value of "No" means no cooler is provided and must be purchased separately.	No
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.	Yes
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.	No
Enhanced intel speedstep technology	Yes
Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.	Yes
Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.	Yes
Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.	Yes
Intel Demand Based Switching Indicates whether the product incorporates Intel’s Demand‑Based Switching technology, which dynamically adjusts power delivery to components based on workload demands, improving energy efficiency and performance.	Yes
Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.	Yes
Intel flex memory access Indicates whether the product supports Intel’s flexible memory access feature, which allows dynamic allocation and sharing of memory resources between the CPU and other components to improve performance and power efficiency.	No
Intel Identity Protection Technology version Indicates the specific version number of Intel’s Identity Protection Technology that a product supports or implements. The value is typically a numeric string such as "1.00" or "0.00", representing the major and minor revision of the feature set.	0.00
Intel Secure Key Technology version The specific version number of Intel Secure Key technology supported by the processor, indicating the generation and capabilities of the secure key feature set.	1.00
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.	Yes
Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.	Yes
Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.	Q1'16
Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.	SRV
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.	1572864 MB
Maximum internal memory supported by processor The largest amount of internal random‑access memory (RAM) that a processor can address and support, expressed as a data size such as megabytes or gigabytes. It indicates the upper limit of memory capacity for active processes and multitasking performance on devices using this CPU.	1536 GB
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed communication channels that can be used simultaneously for peripherals such as graphics cards, storage devices, and networking adapters.	40
Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.	Quad-channel
Memory clock speeds supported by processor The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.	1600,1866,2133,2400 MHz
Memory types supported by processor A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.	DDR4-SDRAM
Number of QPI links The total count of Quick Path Interconnect (QPI) connections present in a processor or motherboard. This value indicates how many QPI links are available for high‑speed communication between CPUs, memory controllers, or other components. It is a simple integer that helps users compare interconnect capabilities across different models.	2
On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	No
Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.	101 mm
Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.	44 mm
PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.	3.0
Processor ARK ID The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.	91750
Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.	3.5 GHz
Processor brand name The name of the company that designs and produces the central processing unit used in a device, such as Intel, AMD or Qualcomm. It identifies the manufacturer so users can quickly see which brand’s processors are supported by the product.	Intel Xeon
Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.	Smart Cache
Processor codename	Broadwell
Processor cores The total number of physical processing units in a single central processing unit (CPU). This value indicates how many independent tasks the CPU can handle simultaneously, influencing multitasking and parallel performance.	12
Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.	Intel® Xeon® E5 v4
Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.	3 GHz
Processor lithography The lithography process defines the minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.	14 nm
Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.	Intel
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.	E5-2687WV4
Processor operating modes The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute indicates the architectural mode(s) supported by the CPU and helps users determine compatibility with software that requires a specific bitness.	64-bit
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.	45 x 52.5 mm
Processor series The processor series identifies the family or generation of a CPU, such as "Intel Xeon E5-2600" or "AMD Ryzen 5000". It is used to group models that share similar architecture, performance characteristics and compatibility features.	Intel Xeon E5-2600 v4
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.	LGA 2011-v3
Processor threads The number of independent execution units (threads) that a processor can handle simultaneously. This value indicates how many parallel tasks the CPU can process at once, which affects multitasking performance and workload distribution.	24
Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.	Processor
Status	Launched
Stepping Der CPU‑Stepping bezeichnet die interne Version eines Prozessormodells, die bei jeder neuen Fertigungsrunde geändert wird. Er gibt an, welche Revision des Chips verwendet wurde und kann Einfluss auf Leistung, Energieverbrauch oder Kompatibilität haben.	M0
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.	AVX 2.0
Tcase Valor que indica la temperatura a la cual el producto opera o se mantiene durante su uso normal. Se expresa en grados Celsius, Fahrenheit o Kelvin según el contexto del fabricante y permite comparar condiciones térmicas entre dispositivos similares.	76 °C
Thermal monitoring technologies	Yes