Fujitsu vfyt1322sc030in network server

Fujitsu (5711783370987 / VFY:T1322SC030IN) - QPI - Tower - DDR4-SDRAM - Dual - DDR3L-SDRAM,DDR4-SDRAM - Intel® C236 - DVD Super Multi - Smart Cache - SR2LG - Skylake - Intel® Xeon® E3 v5 - E3-1220V5

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Fujitsu VFYT1322SC030IN Network Server

The Fujitsu VFYT1322SC030IN is a high‑performance network server designed for demanding enterprise environments. Built on the robust Intel Xeon E3-1220V5 platform, this tower server delivers reliable compute power, scalable memory, and versatile connectivity options.

Core Processor Architecture

The heart of the VFYT1322SC030IN is a single Intel Xeon E3-1220V5 processor. This 4‑core, 4‑thread CPU operates at a base frequency of 3 GHz, with an optional turbo boost up to 3.5 GHz. Manufactured on a 14 nm process node and featuring 8 MB Smart Cache, the processor delivers efficient performance for virtualization, database workloads, and high‑throughput applications.

Core Count: 4 cores
Thread Count: 4 threads
Cache: 8 MB Smart Cache
Base Frequency: 3 GHz
Turbo Boost: 3.5 GHz
Instruction Sets: AVX‑2.0, SSE4.1, SSE4.2
64‑bit Architecture: Intel 64
Enhanced SpeedStep: Enabled for dynamic power management
Trusted Execution Technology: Supported
TSX‑NI: Supported for transactional memory operations

Memory and Storage Configuration

The server supports up to 64 GB of DDR4‑SDRAM, with two DIMM slots that can accommodate a maximum of 32 GB per slot. Memory operates at speeds ranging from 1333 MHz to 2133 MHz, and the platform includes ECC (Error Correcting Code) support for enhanced data integrity.

Memory Slots: 2
Maximum Memory: 64 GB DDR4‑SDRAM
Supported Speeds: 1333, 1600, 1866, 2133 MHz
ECC Support: Yes (for error detection and correction)
Memory Voltage: 1.35 V

The server includes a standard DVD Super Multi optical drive, providing flexibility for media installation or data backup.

Expansion and Connectivity

With a versatile PCI Express configuration, the VFYT1322SC030IN offers multiple expansion options:

PCIe Slots: 1×16, 1×8 + 2×4, or 2×8 (all PCIe 3.0)
Maximum PCIe Lanes: 16
USB Ports: 6 USB 2.0 ports for peripheral connectivity
Serial Port: 1 RS‑232 port for legacy device integration
VGA (D‑Sub) Port: 1, enabling basic video output if required
Ethernet LAN: Integrated 10/100/1000Base‑T(X) network interface for high‑speed connectivity

Power and Thermal Management

The server is powered by a reliable 250 W power supply, ensuring efficient operation under typical workloads. Advanced thermal monitoring technologies keep the system within safe operating temperatures, while Intel’s enhanced halt state and idle states reduce power consumption during low‑activity periods.

Power Supply: 250 W
Thermal Monitoring: Enabled
Idle States: Supported for energy savings
Execute Disable Bit: Enabled to protect against buffer‑overrun attacks

Form Factor and Physical Dimensions

The VFYT1322SC030IN is a compact tower chassis, measuring 340 mm in height, 98 mm in width, and 399 mm in depth. Weighing approximately 10 kg, it balances space efficiency with robust internal architecture.

Height: 340 mm
Width: 98 mm
Depth: 399 mm
Weight: 10 kg
Chassis Type: Tower

Operating System Compatibility

This server is engineered to run a wide array of enterprise operating systems, ensuring flexibility for diverse IT environments. Supported platforms include:

Microsoft Hyper‑V Server (2008 R2, 2012, 2012 R2)
Windows Server (2008 R2, 2012, 2012 R2) – Datacenter, Standard, Essentials, Foundation
Microsoft Windows Storage Server (2008 R2, 2012 R2)
VMware vSphere (5.5, 6.0)
SUSE Linux Enterprise Server (11, 12)
Red Hat Enterprise Linux (6, 7)

Compliance and Certifications

The VFYT1322SC030IN meets a comprehensive set of international safety and environmental standards, ensuring reliable operation across global deployments:

CB, RoHS, GS, CE, CSA US, ULc/US, FCC Class A, WEEE, VCCI:V3 Class A
JIS 61000‑3‑2, GOST‑R, KC, CCC, C‑Tick, BSMI

Key Takeaways

The Fujitsu VFYT1322SC030IN network server combines a powerful Intel Xeon processor, scalable DDR4 memory, versatile PCIe expansion, and robust networking in a compact tower chassis. Its extensive OS support, advanced power‑saving features, and compliance with global standards make it an ideal choice for data centers, virtualization hosts, and enterprise workloads that demand reliability, performance, and flexibility.

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Identifiers
Brand	Fujitsu is a Japanese multinational information technology equipment and services company. It is the world's fourth largest IT services provider measured by revenues.
Model	Fujitsu VFY:T1322SC030IN
MPN	Fujitsu VFY:T1322SC030IN
ID	8136082
Dimensions / Weight
Key Features
Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.	QPI
Cabling technology The type of cable or connector technology used by the product, such as Ethernet standards (e.g., 10/100Base‑T, 1000BASE‑T, 10GBase‑T) or other networking cable types. It indicates the physical medium and protocol supported for data transmission.	10/100/1000Base-T(X)
Chassis type The physical configuration or shape of a computer chassis, such as tower, rack‑mount (e.g., 1U, 2U), desktop, mini‑PC, or other compact designs. It indicates the overall size and mounting style that determines compatibility with motherboards, power supplies, and case accessories.	Tower
Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.	399 mm
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.	Yes
ECC supported by processor Indicates whether the processor in a device supports Error Correcting Code (ECC) memory, allowing detection and correction of single-bit errors during data storage or transfer.	Yes
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.	No
Enhanced intel speedstep technology	Yes
Ethernet LAN Indicates whether the product includes an Ethernet LAN interface for wired network connectivity, allowing data transmission over RJ‑45 or compatible cables.	Yes
Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.	Yes
Graphics & IMC lithography The minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.	14 nm
Height The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.	340 mm
Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.	Yes
Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.	Yes
Intel clear video technology Indicates whether the product incorporates Intel’s Clear Video HD technology, a hardware feature that enhances video playback and capture quality by providing smoother motion, reduced artifacts, and improved color accuracy.	No
Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.	Yes
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.	Yes
Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.	Yes
Internal memory The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.	8 GB
Internal memory type The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.	DDR4-SDRAM
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.	64 GB
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed data channels that can be used simultaneously for peripherals such as graphics cards, storage controllers, and networking adapters.	16
Memory channels supported by processor The total count of independent memory channels supported by a processor or motherboard, indicating how many separate memory paths can be used simultaneously. This value helps users understand the potential for parallel memory access and overall system performance.	Dual
Memory clock speed The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.	2133 MHz
Memory clock speeds supported by processor A list of the operating frequencies that a processor can run at, expressed in hertz (Hz). The values are typically given as MHz or GHz and may include multiple speeds separated by commas to indicate base, boost, or other supported clock rates. This attribute helps users compare the performance potential of different CPUs and understand the range of speeds they can achieve under various workloads.	1333,1600,1866,2133 MHz
Memory slots The count of physical memory slots available on a device for installing RAM modules. It indicates how many separate memory sticks can be installed or upgraded.	2
Memory types supported by processor	DDR3L-SDRAM,DDR4-SDRAM
Memory voltage supported by processor The operating voltage required or supplied to the processor, expressed in volts (V). It indicates the electrical potential that powers the CPU and is essential for ensuring proper performance and compatibility with power delivery systems.	1.35 V
Motherboard chipset The model of the motherboard’s chipset, indicating the family of supported processors and integrated features such as I/O interfaces, memory support, and peripheral connectivity.	Intel® C236
Number of processors installed The total count of physical processor units that are installed in a device. It represents how many separate CPU cores or chips are present, regardless of model or generation.	1
On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	No
Operating system installed The operating system that is installed on the device, indicating the software platform that manages hardware resources and provides services for applications. It can be a commercial OS such as Windows or macOS, an open‑source distribution like Linux, or a proprietary firmware used in embedded devices.	No
Optical drive type The type of optical drive included in a computer or related device, such as DVD‑RW, DVD‑Writer, Blu‑Ray RW, or no optical drive. This attribute indicates whether the product can read or write optical media and specifies the particular model or capability when available.	DVD Super Multi
PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.	1x16,1x8+2x4,2x8
PCI Express slots version The version of the PCI Express specification supported by a device or component. It indicates the maximum bandwidth and compatibility with PCIe devices such as graphics cards, storage controllers, and expansion cards. The value is typically expressed as a numeric revision (e.g., 2.0, 3.0, 4.0) but may also include descriptive labels for specific generations.	3.0
Power supply The electrical power consumption or output of the product, expressed in watts (W). It indicates how much energy the device uses during operation or how much power it can deliver to connected equipment.	250 W
Processor ARK ID The unique numeric identifier assigned by Intel to each processor model, used for precise identification and lookup of technical specifications.	88172
Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.	3.5 GHz
Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.	Smart Cache
Processor codename	Skylake
Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.	3 GHz
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.	E3-1220V5
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.	37.5 x 37.5 mm
Processor series The processor series identifies the family or generation of a CPU, such as "Intel Xeon E5-2600" or "AMD Ryzen 5000". It is used to group models that share similar architecture, performance characteristics and compatibility features.	Intel Xeon E3-1200 v5
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.	LGA 1151 (Socket H4)
Stepping The processor stepping code identifies the specific revision of a CPU model, indicating changes in manufacturing that may affect performance, power consumption or compatibility. It is used to distinguish between different silicon revisions within the same product line.	R0
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.	AVX 2.0,SSE4.1,SSE4.2
Thermal monitoring technologies	Yes
USB 2.0 ports quantity Represents the count of external USB 2.0 (high‑speed) connectors available on a device. The value is an integer indicating how many USB 2.0 ports can be used for data transfer or power delivery from the outside of the product, regardless of internal placement or version.	6
Weight The mass of the product expressed in a standard unit such as grams or kilograms. It represents how heavy the item is and can be used for shipping calculations, handling instructions, or consumer information.	10 kg
Width The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.	98 mm