Fujitsu Thermal Management Kit for Secondary CPU

Overview

The Fujitsu Thermal Management Kit for Secondary CPU is a comprehensive cooling solution engineered to keep the second processor in high‑performance server systems operating at optimal temperatures. Designed for Fujitsu’s PRIMERGY TX2550 and related platforms, this kit integrates advanced heat‑pipe technology with a precision fan assembly to deliver reliable thermal control under heavy workloads.

Design Features

Heat‑Pipe Architecture: The kit employs a series of copper heat pipes that efficiently transfer heat from the CPU die to the external heat sink. The sealed, vacuum‑filled pipes ensure minimal thermal resistance and maintain consistent performance across a wide temperature range.

High‑Efficiency Fan: A dedicated 120 mm fan with a low noise profile is mounted directly onto the heat sink. The fan’s variable speed controller allows for adaptive airflow, increasing cooling capacity when temperatures rise while keeping noise levels low during idle periods.

Robust Heat Sink: Constructed from anodized aluminum, the heat sink features a large surface area with fin arrays optimized for maximum convective heat transfer. The design includes anti‑vibration mounts to reduce mechanical stress on the motherboard.

Easy Installation: The kit comes with a pre‑applied thermal compound and all necessary mounting hardware. Its modular construction allows for quick removal or replacement of the secondary CPU cooler without disturbing the primary processor’s cooling system.

Compatibility

The kit is specifically tailored for Fujitsu PRIMERGY TX2550 M4/M5 and similar server models that support a dual‑CPU configuration. It fits the standard 2 mm socket layout and aligns with the existing motherboard mounting points, ensuring a seamless fit without requiring additional modifications.

Installation Guide

1. Power Down and Disconnect: Shut down the server, unplug all power sources, and open the chassis to access the motherboard.
2. Remove Existing Cooler: Carefully detach any existing secondary CPU cooler, noting the orientation of mounting screws and thermal pads.
3. Apply Thermal Compound: Clean the CPU surface with isopropyl alcohol and apply a pea‑size amount of high‑conductivity thermal paste.
4. Mount the Heat Sink: Align the heat sink with the mounting holes, secure it using the supplied screws, and tighten evenly to avoid uneven pressure.
5. Attach the Fan: Connect the fan’s power cable to the designated header on the motherboard, ensuring correct polarity.
6. Reassemble and Test: Close the chassis, reconnect power, and boot the system. Verify that the fan spins correctly and monitor CPU temperatures via BIOS or monitoring software.

Performance Benefits

Consistent Thermal Regulation: By maintaining lower CPU temperatures, the kit reduces thermal throttling and preserves sustained performance during peak processing demands.

Extended Component Lifespan: Lower operating temperatures translate to reduced thermal stress on the CPU die and surrounding components, potentially extending overall system longevity.

Noise Reduction: The fan’s variable speed control keeps noise levels minimal during low‑intensity tasks, making the server environment more pleasant for operators.

Maintenance and Care

Regular inspection of the fan blades and heat sink fins is recommended to ensure optimal airflow. Dust accumulation can be removed with a soft brush or compressed air, taking care not to damage the heat pipes. Replace the thermal compound every 12–18 months or if you notice a significant rise in CPU temperatures.

Technical Specifications

• Heat Pipe Material: Copper, vacuum‑sealed
• Fan Size: 120 mm diameter, 2000–3000 RPM range
• Heat Sink Material: Anodized aluminum, fin density 120 fin/inch
• Mounting Interface: Standard 2 mm dual‑CPU socket
• Power Consumption: < 5 W (fan only)
• Operating Temperature Range: –40 °C to +85 °C
• Dimensions: 140 mm × 140 mm × 60 mm (approx.)
• Weight: 0.8 kg

Conclusion

The Fujitsu Thermal Management Kit for Secondary CPU delivers a reliable, high‑performance cooling solution that is essential for maintaining system stability in demanding server environments. Its thoughtful design, ease of installation, and proven thermal efficiency make it a valuable upgrade for any dual‑CPU Fujitsu platform.