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Hewlett Packard ML350 GEN9 E5-2603V3 KIT
Hewlett Packard ML350 GEN9 E5-2603V3 KIT includes a powerful Intel Xeon E5-2603 v3 processor with a speed of 1.6 GHz, making it an ideal solution for businesses seeking performance and efficiency in their server infrastructure
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Hewlett Packard ML350 GEN9 E5-2603V3 KIT
The HP ML350 Gen9 E5‑2603V3 Kit is a high‑performance server processor designed for demanding enterprise workloads. Built on Intel’s 22 nm architecture, this six‑core, six‑thread Xeon offers robust compute power while maintaining energy efficiency and thermal stability.
Core Architecture & Performance
- Processor family: Intel® Xeon E5 v3
- Model: E5‑2603V3
- Cores / Threads: 6 / 6
- Base Frequency: 1.60 GHz
- Turbo Boost Technology: Enabled (2× boost)
- Cache: 15 MB L3
- Instruction Sets: AVX‑2.0, 64‑bit operating mode
- Lithography: 22 nm
Memory & Bus Interface
- Socket: LGA 2011‑v3 (compatible with ProLiant ML350 Gen9 motherboards)
- Supported Memory Types: DDR4‑SDRAM
- Memory Channels: Quad‑channel architecture
- Maximum Supported Memory: 786 432 MB (768 GB) per socket
- Memory Clock Speed: 1600 MHz
- System Bus Rate: 6.4 GT/s via QPI interface
- PCI Express Lanes: Up to 40 lanes, PCIe 3.0 slots
Thermal & Power Characteristics
- Tcase Temperature: 72.8 °C (maximum operating temperature)
- Thermal Design Power (TDP): 85 W
- Voltage Range (VID): 0.65 V – 1.35 V (typical)
Scalability & Compatibility
- Scalable to: Dual‑socket configurations (2 S) for increased throughput and redundancy.
- Platform: Designed specifically for HP ProLiant ML350 Gen9 servers, ensuring seamless integration with existing infrastructure.
Key Features & Benefits
- High Core Density: Six cores provide balanced performance for multi‑threaded applications without excessive power draw.
- Efficient Turbo Boost: Dynamic frequency scaling delivers extra headroom during peak workloads while conserving energy when idle.
- Large L3 Cache: 15 MB of on‑chip cache reduces memory latency for compute‑intensive tasks.
- Quad‑Channel DDR4 Support: Enables high memory bandwidth, essential for virtualization and database operations.
- PCIe 3.0 Compatibility: Supports modern storage and networking cards with ample lane allocation.
- Robust Thermal Design: 85 W TDP allows deployment in dense rack environments without excessive cooling requirements.
Typical Use Cases
- Virtualization Platforms: Ideal for VMware ESXi, Microsoft Hyper‑V, or KVM hosts requiring reliable performance across multiple virtual machines.
- Enterprise Databases: Supports SQL Server, Oracle, and PostgreSQL workloads with consistent throughput.
- High‑Performance Computing (HPC): Suitable for scientific simulations that benefit from multi‑core processing and large memory capacity.
- Business Applications: Handles ERP, CRM, and other mission‑critical applications in a server environment.
Installation & Integration Notes
- Insert the processor into an LGA 2011‑v3 socket on a compatible ProLiant ML350 Gen9 motherboard. Ensure proper thermal paste application and secure the CPU cooler before powering on.
- Configure BIOS settings to enable Intel Turbo Boost, set memory timings for DDR4‑1600, and verify PCIe lane allocation for optimal performance.
- For dual‑socket systems, pair identical processors to maintain symmetrical load distribution and maximize scalability.
Conclusion
The HP ML350 Gen9 E5‑2603V3 Kit delivers a balanced blend of compute power, memory bandwidth, and energy efficiency. Its six‑core architecture, coupled with robust cache and DDR4 support, makes it an excellent choice for enterprise servers that demand reliability and scalability without compromising on performance.
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Category
This product is cataloged in our store in these categories
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- Processors for computers |
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International
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Predominant colors of the product |
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| Identifiers | |
| Brand |  HP is a technology company that creates a wide range of products, including personal computers, printers and scanners, and software. |
| MPN | HP 726664-B21 |
| Model | HP 726664-B21#0D1 |
| ID | 6185990 |
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| Key Features | |
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Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
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QPI |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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Server/workstation |
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Intel® Turbo Boost Technology The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
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2 |
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Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
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Server |
| Maximum internal memory supported by processor | 786432 MB |
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Maximum PCI Express lanes Cantidad total de líneas (lanes) de la interfaz PCI Express disponibles en un dispositivo o placa base. Cada línea permite el flujo de datos entre el procesador y los dispositivos conectados, por lo que este número indica la capacidad máxima de ancho de banda para tarjetas y periféricos compatibles con PCIe.
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40 |
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Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
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Quad-channel |
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Memory clock speeds supported by processor A list of the operating frequencies that a processor can run at, expressed in hertz (Hz). The values are typically given as MHz or GHz and may include multiple speeds separated by commas to indicate base, boost, or other supported clock rates. This attribute helps users compare the performance potential of different CPUs and understand the range of speeds they can achieve under various workloads.
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1600 MHz |
| Memory types supported by processor | DDR4-SDRAM |
| PCI Express slots version | 3 |
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Processor base frequency The minimum clock speed at which a CPU operates under normal conditions, expressed in hertz (Hz). It represents the core’s base operating rate and is used to compare performance potential across processors.
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1.6 GHz |
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Processor cache The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.
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15 MB |
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Processor cores The total number of physical processing units in a single central processing unit (CPU). This value indicates how many independent tasks the CPU can handle simultaneously, influencing multitasking and parallel performance.
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6 |
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Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
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Intel Xeon E5 v3 |
| Processor lithography | 22 nm |
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Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
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E5-2603V3 |
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Processor operating modes The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute lists the supported modes for the CPU and helps users determine compatibility with software that requires a specific bitness.
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64-bit |
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Processor socket The physical connector used by a processor to attach to a motherboard or compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.
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LGA 2011-v3 |
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Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
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AVX 2.0 |
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Tcase The highest temperature at which the product can safely operate without risk of damage or performance degradation. It is expressed in degrees Celsius and applies to all electronic components such as processors, servers, storage devices, and other hardware that generate heat during normal use.
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72.8 °C |
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Thermal design power The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.
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85 W |
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VID voltage range The range of electrical voltage that a CPU can safely accept from its power source, expressed in volts (V). It indicates the minimum and maximum supply voltages compatible with the processor, covering both AC and DC inputs where applicable.
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0.65 |
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