Hyper X HX429 °C17FBK4/64 memory
HyperX (0740617277814 / HX429C17FBK4/64) - Unregistered (unbuffered) - PC/server - Heatsink - DDR4 - Gold - 288-pin DIMM - Tray - CAS Latency: 17 - Number of cartons per pallet: 18 - Depth: 7
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Hyper X HX429 °C17FBK4/64 Memory is a high‑performance DDR4 module designed for demanding PC and server environments. With a total capacity of 64 GB, it delivers exceptional multitasking capabilities and robust data throughput, making it ideal for content creation, virtualization, scientific computing, and enterprise workloads.
Key Specifications
- Form Factor: 288‑pin DIMM, 7.08 mm depth, 34 mm height, 133.3 mm width – a standard size that fits seamlessly into most motherboards and server chassis.
- Capacity & Layout: 4 × 16 GB modules, totaling 64 GB of internal memory. This configuration balances density with heat dissipation, ensuring stable operation under heavy loads.
- Speed: 2933 MHz – a high clock rate that maximizes bandwidth and reduces latency for data‑intensive applications.
- CAS Latency: 17 – a low latency figure that translates into faster memory access times, improving overall system responsiveness.
- Voltage: 1.2 V – an energy‑efficient operating voltage that reduces power consumption and heat generation.
- Heat Management: Equipped with a heatsink, the module dissipates heat effectively, maintaining performance stability even during prolonged usage.
- Unregistered (Unbuffered) Design: Suitable for standard consumer PCs as well as many server platforms that do not require registered memory. This design offers a balance between cost and performance.
- Lead Plating: Gold – enhances signal integrity and protects against corrosion, ensuring long‑term reliability.
Compatibility & Operating System Support
The Hyper X HX429 °C17FBK4/64 is engineered for broad compatibility across modern operating systems:
- Linux: Fully supported on major distributions, enabling high‑throughput workloads and virtualization stacks.
- Windows: Compatible with Windows 10, Windows Server 2019, and newer releases, providing smooth performance for gaming, professional software, and enterprise applications.
- Mac OS: Supported on compatible Mac hardware that accepts DDR4 DIMM modules, allowing developers to leverage high memory capacities on Apple systems.
Physical Packaging & Logistics
The module is packaged in a tray format, facilitating efficient handling and storage. Key packaging dimensions include:
- Package Depth: 167.6 mm
- Package Height: 39.1 mm
- Package Width: 104.1 mm
- Weight per Unit: 152.9 g – lightweight for easy installation.
For distribution, each pallet contains 18 cartons, with a total of 2700 units per pallet. This high-density packaging supports efficient logistics and inventory management.
Performance Highlights
- High Bandwidth: 2933 MHz DDR4 delivers up to 23.5 GB/s per channel, enabling rapid data transfer for memory‑bound applications.
- Low Latency: CAS 17 reduces the time between a request and data delivery, improving frame rates in gaming and reducing render times in creative software.
- Scalable Architecture: The 4 × 16 GB layout allows easy expansion to larger capacities by adding additional modules or upgrading to higher‑density kits.
- Thermal Efficiency: The integrated heatsink, combined with a low operating voltage, keeps temperatures within safe limits even under sustained load.
Ideal Use Cases
- Content Creation: Video editing, 3D rendering, and graphic design benefit from the large memory pool and fast access speeds.
- Virtualization & Cloud Computing: Hyper‑converged infrastructure and virtual machine hosts can run multiple instances simultaneously without performance bottlenecks.
- Scientific Research: High‑performance computing tasks, such as simulations and data analysis, require the bandwidth and capacity offered by this module.
- Enterprise Servers: Database servers, application servers, and file servers gain from the reliable, unbuffered design that balances cost with performance.
Conclusion
The Hyper X HX429 °C17FBK4/64 Memory stands out as a versatile, high‑capacity DDR4 solution. Its combination of 2933 MHz speed, CAS 17 latency, and robust heatsink design delivers reliable performance across a wide range of operating systems and workloads. Whether you are building a powerful workstation, scaling a server farm, or developing next‑generation applications, this memory module provides the capacity, speed, and stability needed to meet demanding computing challenges.
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Category
This product is cataloged in our store in these categories
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- RAM for computer |
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International
Find this product in one of our international stores
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Predominant colors of the product |
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| Identifiers | |
| Brand |  HyperX is a gaming brand that produces headsets, keyboards, mice, and other gaming peripherals. The company was founded in 2002 and is now a division of Kingston Technology. HyperX is known for its high-quality products and for its sponsorship of professional gaming teams. |
| Model | HyperX HX429C17FBK4/64 |
| MPN | HyperX HX429C17FBK4/64 |
| ID | 8957231 |
| Dimensions / Weight | |
| Key Features | |
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Buffered memory type The type of buffering applied to a memory module, indicating whether the RAM is unbuffered (unregistered), buffered (registered), or fully buffered. This attribute helps users understand compatibility and performance characteristics for computer systems.
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Unregistered (unbuffered) |
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CAS Latency The number of clock cycles that a memory module takes to complete a read operation after the address has been sent. It indicates how quickly data can be accessed from RAM and affects overall system performance, especially in high‑speed memory configurations.
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17 |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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PC/server |
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Cooling type The method used to dissipate heat from a component or system, such as active cooling (fans or liquid loops), passive heat sinks, or no active cooling. It indicates whether the product relies on airflow, conduction, or other mechanisms to maintain safe operating temperatures.
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Heatsink |
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Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
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7.08 mm |
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ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
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No |
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Height The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.
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34 mm |
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Internal memory The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
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64 GB |
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Internal memory type The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.
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DDR4 |
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Lead plating The material or finish applied to the lead components of a product, such as gold, nickel, copper or other plated metals. It indicates the type of metal coating used for corrosion resistance, conductivity and durability in electronic leads.
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Gold |
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Linux operating systems supported List of Linux operating systems that the product can run or support, including specific versions and architectures when relevant. Each value represents a distinct Linux distribution or kernel version supported by the hardware or software.
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Yes |
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Mac operating systems supported A list of macOS operating system versions that the product supports or is compatible with, such as "macOS 10.15 Catalina", "macOS 11 Big Sur" or newer releases. Each entry represents a distinct OS version that can run on or be supported by the device.
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Yes |
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Memory clock speed The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.
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2933 MHz |
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Memory form factor The physical configuration or size classification of a memory module, such as SO‑DIMM, UDIMM, RDIMM, or on‑board. It indicates the form factor that determines compatibility with motherboards and other hardware components.
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288-pin DIMM |
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Memory voltage The electrical voltage required by the RAM modules of a device, expressed in volts (V). It indicates the operating supply voltage that the memory needs to function correctly and safely.
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1.2 V |
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Number of cartons per pallet The total count of individual cartons that are stacked or arranged on a single pallet for shipping or storage purposes. It indicates how many separate packaging units fit within one pallet configuration and is used to calculate load capacity, logistics planning, and inventory management.
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18 |
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Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.
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167.6 mm |
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Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.
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39.1 mm |
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Package type The form of packaging used for a product, such as box, blister pack, bag, or pallet. It indicates how the item is contained and protected during shipping and storage.
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Tray |
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Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.
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104.1 mm |
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Quantity per pallet Represents the number of individual items or units that can be placed on a single pallet. This value indicates how many pieces, packages, or components are stored or shipped together on one pallet, helping users assess storage capacity and logistics planning.
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2700 pc(s) |
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Weight The mass of the product expressed in a standard unit such as grams or kilograms. It represents how heavy the item is and can be used for shipping calculations, handling instructions, or consumer information.
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152.9 g |
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Width The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.
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133.3 mm |
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Windows operating systems supported A list of Microsoft Windows operating system versions that the product is compatible with, including any relevant architecture or edition information.
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Yes |
