Hyper X HX429 °C17FR2 K4/32 Memory

Hyper X HX429 °C17FR2 K4/32 Memory Overview

The Hyper X HX429 °C17FR2 K4/32 Memory is a high‑performance DDR4 module engineered for both desktop and server environments. With its 2933 MHz speed, 17 CAS latency, and generous 32 GB capacity per DIMM, this memory unit delivers the bandwidth and responsiveness required by demanding workloads such as virtual machine hosting, content creation, and real‑time data analytics.

Key Technical Specifications

• Memory Type: DDR4
• Form Factor: 288‑pin DIMM (desktop/server)
• Capacity: 32 GB per module
• Speed: 2933 MHz (DDR4-2933)
• CAS Latency: 17
• Voltage: 1.2 V
• Unbuffered / Unregistered: Yes (no ECC, no registered buffer)
• Cooling Solution: Integrated heatsink for efficient thermal dissipation
• Lead Plating: Gold to enhance conductivity and reduce corrosion
• Dimensions (module): Height 34 mm, Width 133.3 mm, Depth 7.08 mm
• Package (tray) Dimensions: Height 39.1 mm, Width 104.1 mm, Depth 167.6 mm
• Weight per Module: 152.9 g

Operating System Compatibility

This memory module is fully supported across major operating systems, ensuring seamless integration into a variety of computing environments.

• Windows – Compatible with all modern Windows releases (10/11 and server editions).
• Linux – Supported by mainstream distributions such as Ubuntu, CentOS, Debian, and Fedora.
• macOS – Works on Apple silicon and Intel‑based Macs that support DDR4 memory configurations.

Performance Characteristics

The combination of a high clock speed (2933 MHz) and low CAS latency (17) provides a balanced performance profile. Users will experience:

• Increased Bandwidth: The 2933 MHz frequency translates to approximately 23.5 GB/s per channel, enabling rapid data transfer for memory‑intensive applications.
• Reduced Latency: A CAS latency of 17 cycles at this speed results in a real‑world latency of roughly 5.8 ns, which is critical for tasks that require quick access to large datasets.
• Thermal Management: The integrated heatsink dissipates heat effectively, maintaining stable operation even under sustained load.

Installation and Configuration Guidance

When installing the Hyper X HX429 °C17FR2 K4/32 Memory, follow these best practices to ensure optimal performance:

1. Slot Placement: For dual‑channel or multi‑channel configurations, insert modules into alternating slots (e.g., A1 and B3) to maximize bandwidth.
2. BIOS Settings: Verify that the BIOS is set to Auto for memory frequency and latency. If manual tuning is desired, ensure that the selected values match the module’s specifications.
3. Power Management: Enable XMP (Extreme Memory Profile) if available; this automatically configures voltage and timing settings to the manufacturer’s recommended parameters.
4. Thermal Monitoring: Use system monitoring tools to keep an eye on memory temperature, especially during heavy workloads. The heatsink should keep temperatures well below 70 °C under typical use.

Use Cases and Target Applications

The Hyper X HX429 °C17FR2 K4/32 Memory is ideal for a wide range of scenarios:

• Virtualization Platforms: Running multiple virtual machines simultaneously benefits from the large capacity and high bandwidth.
• Content Creation: Video editing, 3D rendering, and graphic design workflows require fast memory access to handle large project files.
• Data Analytics & Machine Learning: High‑throughput data processing tasks gain from the module’s low latency and robust performance.
• Gaming Systems: While not specifically marketed as a gaming component, its speed and capacity provide smooth gameplay for memory‑heavy titles.

Reliability and Build Quality

The use of gold plating on the contacts enhances electrical conductivity and reduces the risk of corrosion over time. The unbuffered design ensures minimal added latency, making it suitable for performance‑critical environments where speed is paramount.

Packaging and Logistics Information

For distribution and inventory purposes, each pallet contains:

• Number of Cartons per Pallet: 18
• Quantity per Pallet: 2700 units
• Package Type: Tray (dimensions: 104.1 mm × 167.6 mm × 39.1 mm)

Conclusion

The Hyper X HX429 °C17FR2 K4/32 Memory stands out as a robust, high‑speed DDR4 solution for both consumer and enterprise computing needs. Its blend of large capacity, rapid data transfer rates, low latency, and reliable thermal management makes it an excellent choice for anyone seeking to elevate system performance without compromising on stability or compatibility.