Hyper X HX432 °C18FBK2/32 Memory
HyperX (0740617278132 / HX432C18FBK2/32) - Unregistered (unbuffered) - PC/server - DDR4 - Gold - 288-pin DIMM - Tray - CAS Latency: 18 - Cooling type: Heatsink - Depth: 7
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Hyper X HX432 °C18FBK2/32 Memory Overview
The Hyper X HX432 °C18FBK2/32 is a high‑performance DDR4 memory kit designed for both gaming and professional workloads. It delivers 32 GB of total capacity, split into two 16 GB modules, enabling dual‑channel operation for maximum bandwidth.
Key Technical Specifications
- Form Factor: 288‑pin DIMM (desktop/server)
- Capacity: 32 GB total (2 × 16 GB)
- Speed: 3200 MHz memory clock
- CAS Latency: CL18
- Voltage: 1.2 V
- Memory Type: DDR4, unregistered (unbuffered)
- Heat Spreader: Integrated heatsink for efficient thermal management
- Intel XMP Version: 2.0 – automatically configures optimal timings on compatible motherboards
- SPD Support: Yes, ensuring accurate timing data is read by the system BIOS
- Operating Temperature Range: 0 °C to 85 °C (in use); storage range −55 °C to +100 °C
- Weight per Module: 76.4 g; total kit weight 152.8 g
- Lead Plating: Gold for reliable electrical contact and corrosion resistance
Physical Dimensions & Packaging
The modules measure 133.3 mm in width, 7.08 mm in depth, and 34 mm in height. Each kit is packaged on a tray with dimensions of 95.2 mm (width) × 13.9 mm (depth) × 171.4 mm (height). The shipping carton holds 25 kits, and a pallet contains 18 cartons for efficient logistics.
Compatibility & Operating System Support
This memory is fully compatible with Windows, Linux, and macOS operating systems. Its DDR4 architecture ensures seamless integration with modern motherboards that support 3200 MHz modules, whether for gaming rigs or workstation servers.
Performance Highlights
- Dual‑Channel Architecture: Doubles memory bandwidth compared to single‑module configurations.
- Low Latency (CL18): Provides quick access times for demanding applications such as video editing, 3D rendering, and large database operations.
- High Clock Speed (3200 MHz): Delivers ample bandwidth for multitasking environments and high‑resolution gaming.
- Efficient Thermal Design: The heatsink dissipates heat effectively, maintaining stable performance even under sustained load.
Installation & Setup
Installing the Hyper X HX432 °C18FBK2/32 is straightforward. Slot each 16 GB module into the appropriate DIMM slots on your motherboard, ensuring proper alignment with the notch. Once installed, enable Intel XMP 2.0 in the BIOS to automatically apply the optimal timings and voltage settings.
Reliability & Build Quality
The modules feature gold‑plated contacts, which reduce resistance and improve signal integrity. The unbuffered design keeps latency low, while the robust heatsink ensures longevity under continuous operation. With a wide operating temperature range, these modules are suitable for both consumer desktops and professional server environments.
Conclusion
The Hyper X HX432 °C18FBK2/32 Memory kit combines high capacity, fast speeds, low latency, and solid build quality. Whether you’re building a next‑generation gaming system or upgrading a workstation for intensive workloads, this DDR4 kit delivers the performance and reliability required by modern computing demands.
| This product in Comparor | |
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Category
This product is cataloged in our store in these categories
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- RAM for computer |
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International
Find this product in one of our international stores
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 150.30 EUR   |
| Colors
Predominant colors of the product |
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| Tags | KingstonFury Black |
| Identifiers | |
| Brand |  HyperX is a gaming brand that produces headsets, keyboards, mice, and other gaming peripherals. The company was founded in 2002 and is now a division of Kingston Technology. HyperX is known for its high-quality products and for its sponsorship of professional gaming teams. |
| Model | HyperX HX432C18FBK2/32 |
| MPN | HyperX HX432C18FBK2/32 |
| ID | 8957205 |
| Dimensions / Weight | |
| Key Features | |
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Buffered memory type The type of buffering applied to a memory module, indicating whether the RAM is unbuffered (unregistered), buffered (registered), or fully buffered. This attribute helps users understand compatibility and performance characteristics for computer systems.
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Unregistered (unbuffered) |
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CAS Latency The number of clock cycles that a memory module takes to complete a read operation after the address has been sent. It indicates how quickly data can be accessed from RAM and affects overall system performance, especially in high‑speed memory configurations.
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18 |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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PC/server |
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Cooling type The method used to dissipate heat from a component or system, such as active cooling (fans or liquid loops), passive heat sinks, or no active cooling. It indicates whether the product relies on airflow, conduction, or other mechanisms to maintain safe operating temperatures.
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Heatsink |
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Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
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7.08 mm |
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ECC Indica si el producto cuenta con la característica o función especificada. El valor puede ser "Sí" (disponible) o "No" (no disponible).
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No |
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Height The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.
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34 mm |
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Internal memory The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
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32 GB |
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Internal memory type The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.
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DDR4 |
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Lead plating The material or finish applied to the lead components of a product, such as gold, nickel, copper or other plated metals. It indicates the type of metal coating used for corrosion resistance, conductivity and durability in electronic leads.
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Gold |
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Linux operating systems supported List of Linux operating systems that the product is compatible with, including specific versions and architectures when relevant. Each value represents a distinct Linux distribution or kernel version supported by the hardware or software.
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Yes |
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Mac operating systems supported A list of macOS operating system versions that the product supports or is compatible with, such as "macOS 10.15 Catalina", "macOS 11 Big Sur" or newer releases. Each entry represents a distinct OS version that can run on or be supported by the device.
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Yes |
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Memory clock speed The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.
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3200 MHz |
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Memory form factor The physical configuration or size classification of a memory module, such as SO‑DIMM, UDIMM, RDIMM, or on‑board. It indicates the form factor that determines compatibility with motherboards and other hardware components.
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288-pin DIMM |
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Memory voltage The electrical voltage required by the RAM modules of a device, expressed in volts (V). It indicates the operating supply voltage that the memory needs to function correctly and safely.
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1.2 V |
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Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.
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13.9 mm |
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Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.
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171.4 mm |
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Package type The form of packaging used for a product, such as box, blister pack, bag, or pallet. It indicates how the item is contained and protected during shipping and storage.
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Tray |
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Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.
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95.2 mm |
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Quantity per pallet Represents the number of individual items or units that can be placed on a single pallet. This value indicates how many pieces, packages, or components are stored or shipped together on one pallet, helping users assess storage capacity and logistics planning.
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3600 pc(s) |
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Weight The mass of the product expressed in a standard unit such as grams or kilograms. It represents how heavy the item is and can be used for shipping calculations, handling instructions, or consumer information.
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76.4 g |
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Width The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.
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133.3 mm |
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Windows operating systems supported A list of Microsoft Windows operating system versions that the product is compatible with, including any relevant architecture or edition information.
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Yes |
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