Hyper X HX434 °C19FR/16 memory module
HyperX (0740617278002 / HX434C19FR/16) - Unregistered (unbuffered) - Red - PC/server - Heatsink - DDR4 - CL19 (19-23-23) - Gold - 288-pin DIMM - Tray - Generic - CAS Latency: 19 - Number of cartons per pallet: 18
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Introducing the Hyper X HX434 °C19FR/16 Memory Module
The Hyper X HX434 °C19FR/16 is a high‑performance, DDR4 3400 MHz memory module designed for demanding desktop and server environments. With its striking red heatsink and precise timing specifications, this module delivers reliable speed and stability for both gaming rigs and professional workstations.
Key Technical Specifications
- Memory Type: Unbuffered (Unregistered)
- Capacity: 16 GB per DIMM (single‑rank)
- Form Factor: 288‑pin DDR4 DIMM
- Clock Speed: 3400 MHz (PC4‑27200)
- Latency Timings: CL19‑23‑23 (CAS Latency 19, RAS to CAS Delay 23, Row Precharge Time 23)
- Voltage: 1.2 V
- Heatsink: Red aluminum heatsink with gold‑plated contacts for enhanced conductivity and durability
- Dimensions: Height 34 mm, Width 133.3 mm, Depth 7.08 mm (module); Package depth 13.9 mm, width 57.1 mm, height 171.4 mm (tray)
- Weight: 38.2 g per module
- Operating System Compatibility: Windows, Linux, and macOS – fully supported across major platforms
- No ECC or Registered Features: Designed for consumer and enthusiast systems rather than enterprise servers that require error‑correcting code memory
Design & Build Quality
The module’s red heatsink** provides excellent thermal dissipation**, ensuring consistent performance even under sustained load. The gold plating on the contacts reduces resistance and improves signal integrity, which is critical for maintaining high data rates at 3400 MHz.
Physical Characteristics
- Module Height: 34 mm – fits standard ATX motherboards without obstruction to rear I/O ports or CPU coolers.
- Depth: 7.08 mm – slim enough for compact builds yet robust enough to handle heavy workloads.
Performance & Reliability
The CL19‑23‑23 timing** is a balanced configuration that offers low latency while maintaining stability at high frequencies. This makes the HX434 °C19FR/16 an ideal choice for:
- Gaming PCs: Fast load times, smooth frame rates, and reduced stutter.
- Content Creation: Quick rendering, video editing, and 3D modeling with ample memory bandwidth.
- Multitasking Environments: Seamless operation of multiple applications without compromising speed.
XMP Compatibility
The module supports XMP (Extreme Memory Profile)**, allowing users to easily overclock the RAM to its rated 3400 MHz** through BIOS settings. This eliminates manual tweaking and ensures that the memory runs at optimal performance out of the box.
Installation & Compatibility
Designed for 288‑pin DDR4 DIMM slots**, the HX434 °C19FR/16 is compatible with a wide range of modern motherboards, including those from Intel and AMD that support DDR4 memory. Its unbuffered nature means it can be installed in consumer-grade systems without requiring special server components.
Operating System Support
The module’s compatibility extends across major operating systems:
- Windows: Fully supported on Windows 10/11 and earlier versions.
- Linux: Works seamlessly with popular distributions such as Ubuntu, Fedora, and Debian.
- macOS: Compatible with Apple’s macOS for users who build or upgrade Mac-compatible PCs.
Packaging & Logistics
The HX434 °C19FR/16 is shipped in a tray package** that measures 57.1 mm wide, 13.9 mm deep, and 171.4 mm high. Each tray contains multiple modules, with a typical pallet holding 18 cartons and 5400 individual units. This packaging design ensures efficient storage and handling during distribution.
Why Choose Hyper X HX434 °C19FR/16?
- High Speed & Low Latency: 3400 MHz with CL19‑23‑23 provides a competitive edge for performance‑centric users.
- Robust Build: Red heatsink and gold plating guarantee durability and thermal efficiency.
- Cross‑Platform Compatibility: Works flawlessly on Windows, Linux, and macOS systems.
- Easy Overclocking: XMP support simplifies achieving rated speeds without manual configuration.
- Compact Footprint: Fits comfortably in most ATX cases while leaving room for other components.
Conclusion
The Hyper X HX434 °C19FR/16** memory module** stands out as a premium choice for users who demand speed, reliability, and versatility. Its combination of high frequency, low latency, and robust construction makes it suitable for gaming enthusiasts, creative professionals, and anyone looking to elevate their system’s performance.
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Category
This product is cataloged in our store in these categories
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- RAM for computer |
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International
Find this product in one of our international stores
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| Colors
Predominant colors of the product |
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| Identifiers | |
| Brand | ![]() HyperX is a gaming brand that produces headsets, keyboards, mice, and other gaming peripherals. The company was founded in 2002 and is now a division of Kingston Technology. HyperX is known for its high-quality products and for its sponsorship of professional gaming teams. |
| Model | HyperX HX434C19FR/16 |
| MPN | HyperX HX434C19FR/16 |
| ID | 8957353 |
| Dimensions / Weight | |
| Key Features | |
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Buffered memory type The type of buffering applied to a memory module, indicating whether the RAM is unbuffered (unregistered), buffered (registered), or fully buffered. This attribute helps users understand compatibility and performance characteristics for computer systems.
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Unregistered (unbuffered) |
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CAS Latency The number of clock cycles that a memory module takes to complete a read operation after the address has been sent. It indicates how quickly data can be accessed from RAM and affects overall system performance, especially in high‑speed memory configurations.
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19 |
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Color category Represents the main color or hue that characterizes a product’s appearance, expressed as a single color name such as "Black", "Red" or "Blue". It is used to identify and compare items based on their visual look.
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Red |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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PC/server |
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Cooling type The method used to dissipate heat from a component or system, such as active cooling (fans or liquid loops), passive heat sinks, or no active cooling. It indicates whether the product relies on airflow, conduction, or other mechanisms to maintain safe operating temperatures.
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Heatsink |
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Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
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7.08 mm |
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ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
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No |
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Height The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.
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34 mm |
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Internal memory The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
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16 GB |
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Internal memory type The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.
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DDR4 |
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Latency timings The timing specification of a memory module, typically expressed as a series of numbers such as CL16 (16-18-18). It indicates the number of clock cycles required for various operations like CAS latency and row activation, providing insight into the module’s performance characteristics.
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CL19 (19-23-23) |
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Lead plating The material or finish applied to the lead components of a product, such as gold, nickel, copper or other plated metals. It indicates the type of metal coating used for corrosion resistance, conductivity and durability in electronic leads.
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Gold |
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Linux operating systems supported List of Linux operating systems that the product can run or support, including specific versions and architectures when relevant. Each value represents a distinct Linux distribution or kernel version supported by the hardware or software.
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Yes |
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Mac operating systems supported A list of macOS operating system versions that the product supports or is compatible with, such as "macOS 10.15 Catalina", "macOS 11 Big Sur" or newer releases. Each entry represents a distinct OS version that can run on or be supported by the device.
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Yes |
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Memory clock speed The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.
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3400 MHz |
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Memory form factor The physical configuration or size classification of a memory module, such as SO‑DIMM, UDIMM, RDIMM, or on‑board. It indicates the form factor that determines compatibility with motherboards and other hardware components.
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288-pin DIMM |
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Memory voltage The electrical voltage required by the RAM modules of a device, expressed in volts (V). It indicates the operating supply voltage that the memory needs to function correctly and safely.
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1.2 V |
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Number of cartons per pallet The total count of individual cartons that are stacked or arranged on a single pallet for shipping or storage purposes. It indicates how many separate packaging units fit within one pallet configuration and is used to calculate load capacity, logistics planning, and inventory management.
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18 |
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Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.
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13.9 mm |
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Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.
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171.4 mm |
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Package type The form of packaging used for a product, such as box, blister pack, bag, or pallet. It indicates how the item is contained and protected during shipping and storage.
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Tray |
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Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.
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57.1 mm |
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Product description Cantidad de energía eléctrica que consume o suministra el producto durante su funcionamiento, expresada en unidades de potencia como vatios (W), kilovatios (kW) u otras equivalentes. Este valor indica la potencia máxima requerida por el dispositivo y permite comparar eficiencia energética, dimensionar fuentes de alimentación y estimar costos operativos.
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HyperX FURY - DDR4 - 16 GB - DIMM 288-pin - unbuffered |
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Quantity per pallet Represents the number of individual items or units that can be placed on a single pallet. This value indicates how many pieces, packages, or components are stored or shipped together on one pallet, helping users assess storage capacity and logistics planning.
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5400 pc(s) |
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Upgrade type The category of hardware or software upgrade applicable to the product, such as whether it is a generic upgrade path or one that is specific to the system. It indicates how the product can be updated or replaced within its intended environment.
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Generic |
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Weight The mass of the product expressed in a standard unit such as grams or kilograms. It represents how heavy the item is and can be used for shipping calculations, handling instructions, or consumer information.
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38.2 g |
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Width The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.
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133.3 mm |
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Windows operating systems supported A list of Microsoft Windows operating system versions that the product is compatible with, including any relevant architecture or edition information.
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Yes |


