Intel BX80684I78700 8th Gen Core i7-8700 Processor

Intel (5032037108591 / BX80684I78700) - 64-bit - DMI3 - GT/s - PC - Hexa Core - Intel - Intel Core i7 - Socket 1151 - Processor - Intel HD Graphics - Q4'17 - DT - Dual-channel - DDR4-SDRAM - 1151-land Flip-Chip Land Grid Array

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Intel Core i7‑8700 8th Generation Processor

The Intel Core i7‑8700, codenamed Coffee Lake, is a flagship desktop processor from Intel’s eighth generation lineup. Built on a refined 14 nm process, it delivers robust performance for demanding workloads while maintaining efficient power consumption.

Core Architecture and Performance

Featuring 6 physical cores and 12 threads, the i7‑8700 employs Intel’s Hyper‑Threading technology to double the number of simultaneous execution contexts. Each core runs at a base frequency of 3.20 GHz and can be dynamically boosted up to 4.60 GHz with Intel Turbo Boost Technology 2.0, ensuring peak performance during single‑threaded tasks or burst workloads.

The processor incorporates 24 execution units, enabling efficient handling of complex instruction streams. It supports a rich set of SIMD extensions including SSE4.1, SSE4.2, AVX2, and the newer AVX‑512 family, providing accelerated performance for scientific computing, media encoding, and gaming.

Cache Hierarchy

The i7‑8700 is equipped with a total of 12 MB Smart Cache, distributed as follows:

L1 cache: 384 KB per core (split into instruction and data caches)
L2 cache: 6 MB total (256 KB per core)
L3 cache: 12 MB shared across all cores, providing fast access to frequently used data.

Integrated Graphics – Intel UHD Graphics 630

The processor includes the Intel UHD Graphics 630, a powerful integrated GPU capable of:

Base frequency: 350 MHz; dynamic up to 1.20 GHz
DirectX support: 12.0; OpenGL: 4.5
Maximum resolution: 4096×2304 at 60 Hz via DisplayPort or embedded DisplayPort, and up to 4096×2304 at 24 Hz over HDMI.
Support for up to three simultaneous displays.
Integrated video acceleration features such as Intel Quick Sync Video and Intel Clear Video HD Technology.

Memory Support

The i7‑8700 supports DDR4 SDRAM up to 2666 MHz in a dual‑channel configuration. The processor can address a maximum of 64 GB of system memory, providing ample headroom for multitasking and memory‑intensive applications.

Bus and I/O Interfaces

Key bus specifications include:

DMI3 interface operating at 8 GT/s, connecting the CPU to the chipset.
PCI Express support: 1×16, 2×8, or 1×8+2×4 configurations with PCIe 3.0 lanes, enabling high‑bandwidth expansion cards such as GPUs and NVMe SSDs.
Maximum memory bandwidth: 41.6 GB/s, ensuring rapid data transfer between the CPU and RAM.

Thermal Design Power (TDP)

The processor’s TDP is rated at 65 W. This moderate power envelope allows for efficient cooling solutions while maintaining high performance. The included cooler provides a reliable thermal path, keeping the CPU within safe operating temperatures.

Advanced Security and Virtualization Features

The i7‑8700 incorporates several security and virtualization technologies:

Intel Trusted Execution Technology (TXT) for secure boot and measured launch.
Intel vPro technology, enabling remote management and enhanced security features for business environments.
Intel Secure Key and Intel Memory Protection Extensions (MPX) for data integrity.
Intel Software Guard Extensions (SGX) for protected execution of sensitive code.
Intel VT‑x with Extended Page Tables (EPT) and Intel Virtualization Technology for efficient virtualization workloads.

Manufacturing Process and Packaging

The processor is fabricated using a refined 14 nm process technology, balancing performance, power efficiency, and yield. It comes in a standard LGA1151 (Socket H4) package, measuring approximately 37.5 mm × 37.5 mm. The boxed configuration includes the CPU, a stock cooler with fan, and all necessary mounting hardware.

Use Cases and Target Audience

The Intel Core i7‑8700 is ideal for:

High‑performance desktop computing, including content creation, video editing, and 3D rendering.
Gaming rigs that benefit from strong single‑threaded performance and integrated graphics support for 4K output.
Professional workstations requiring robust multitasking capabilities and secure virtualization features.
Home office setups where a balance of power, efficiency, and cost-effectiveness is desired.

Key Takeaways

The Intel Core i7‑8700 delivers:

6 cores / 12 threads with dynamic boost up to 4.60 GHz.
12 MB Smart Cache and a strong SIMD instruction set.
Integrated Intel UHD Graphics 630 supporting 4K output.
DDR4‑2666 dual‑channel memory support, up to 64 GB.
PCIe 3.0 lanes for expansion and high bandwidth I/O.
65 W TDP with included cooling solution.
Advanced security and virtualization technologies for business use.

With its blend of performance, efficiency, and feature set, the Intel Core i7‑8700 remains a compelling choice for demanding desktop applications across both consumer and professional domains.

This product in Comparor
Category This product is cataloged in our store in these categories	- Processors for computers
International Find this product in one of our international stores	311.71 EUR 447.44 EUR 429.90 EUR 105.00 EUR
Colors Predominant colors of the product
Tags	Hp Windows
Identifiers
Brand	Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.
Model	Intel BX80684I78700
MPN	Intel BX80684I78700
ID	6185743
Dimensions / Weight
Key Features
Architecture A concise list of the specific processor micro‑architecture or generation used by a CPU, such as "Kaby Lake", "Comet Lake", "Zen 2" or "Rocket Lake‑S". This attribute helps users identify compatibility with software, performance characteristics and hardware requirements.	64-bit
Box Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.	Yes
Bus bandwidth The maximum frequency at which a system bus can transfer data, expressed in hertz (Hz). It indicates the theoretical throughput capability of the bus and allows users to compare performance across different processors or components.	8
Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.	DMI3
Bus type units The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.	GT/s
Cache The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.	12 MB
Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.	PC
Cooler included Indicates whether the product comes with a cooling solution included in its package. A value of "Yes" means a cooler (air, liquid, or passive) is supplied; a value of "No" means no cooler is provided and must be purchased separately.	Yes
Core count The total number of physical cores in a processor, expressed either as a numeric value or in descriptive terms such as "Quad Core" or "Hexa Core". This attribute captures the core count information regardless of whether it is presented numerically or textually.	Hexa Core
CPU Brand The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.	Intel
CPU Family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.	Intel Core i7
CPU Socket The physical connector used by a processor to attach to a motherboard or other compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.	Socket 1151
CPU Speed The maximum operating frequency of a central processing unit (CPU), expressed in hertz (Hz). This value indicates how many cycles per second the CPU can execute under normal conditions and is useful for comparing performance potential across different models.	3.2 GHz
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.	No
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.	Yes
Enhanced intel speedstep technology	Yes
Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.	Yes
Execution units Represents the count of independent execution units within a processor or similar component. The value is an integer without any unit of measure, indicating how many discrete execution cores or threads are available for parallel processing.	24
Form factor Specifies the physical configuration or design of a product, such as ATX, Micro‑ATX, Mini‑ITX, tower, case with cover, etc. It describes how the device is built and what mounting or expansion options it supports.	Processor
Graphics chipset The exact model or designation of the graphics processing unit (GPU) installed in a device, such as "Intel UHD Graphics 620", "NVIDIA GeForce RTX 2070" or "AMD Radeon RX 580". It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	Intel HD Graphics
Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.	Yes
Integrated Graphics Indicates whether a device includes an integrated graphics processor, and if so, provides the model or resolution it supports. Typical values are "Yes" or "No", but may also include specific GPU models (e.g., "Intel UHD Graphics 620") or screen resolutions (e.g., "1920x1080"). This attribute helps users determine whether a device can render graphics without a discrete GPU and what performance level to expect.	Yes
Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.	Yes
Intel clear video technology Indicates whether the product incorporates Intel’s Clear Video HD technology, a hardware feature that enhances video playback and capture quality by providing smoother motion, reduced artifacts, and improved color accuracy.	Yes
Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.	Yes
Intel Identity Protection Technology version Indicates the specific version number of Intel’s Identity Protection Technology that a product supports or implements. The value is typically a numeric string such as "1.00" or "0.00", representing the major and minor revision of the feature set.	1
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.	Yes
Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.	Yes
Intel TSX-NI version The specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by the processor, indicating its capability to handle transactional memory operations efficiently.	1.00
L1 Cache The amount of internal memory reserved for a processor’s L1 cache, expressed in units such as kilobytes (KB), megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.	384 KB
L2 cache The amount of internal memory reserved for a processor’s L2 cache, expressed as a pair of values: the number of banks and the capacity per bank (e.g., "4 x 256 KB"). This format allows specification of both the count of cache banks and the capacity of each bank, which together determine the total L2 cache available to the CPU.	1.5 MB
Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.	Q4'17
Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.	DT
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.	65536 MB
Maximum memory The largest amount of random‑access memory (RAM) that a device or component can support, expressed as a data size such as megabytes or gigabytes. It indicates the upper limit of memory capacity for active processes and multitasking performance.	128 GB
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed data channels that can be used simultaneously for peripherals such as graphics cards, storage controllers, and networking adapters.	16
Maximum resolution & refresh rate (DisplayPort) The highest pixel resolution and refresh rate that a product can output through its DisplayPort interface, expressed as width × height followed by the maximum supported refresh rate (e.g., 4096x2304@60Hz). This value indicates the best visual performance achievable on displays connected via DisplayPort.	4096x2304@60Hz
Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.	Dual-channel
Memory channels supported by processor The total count of independent memory channels supported by a processor or motherboard, indicating how many separate memory paths can be used simultaneously. This value helps users understand the potential for parallel memory access and overall system performance.	Dual
Memory clock speeds supported by processor A list of the operating frequencies that a processor can run at, expressed in hertz (Hz). The values are typically given as MHz or GHz and may include multiple speeds separated by commas to indicate base, boost, or other supported clock rates. This attribute helps users compare the performance potential of different CPUs and understand the range of speeds they can achieve under various workloads.	2666 MHz
Memory types supported by processor	DDR4-SDRAM
Number of cores The total count of processing cores present in a CPU or GPU. This value indicates how many independent execution units are available for parallel processing, which can affect performance and multitasking capability.	6
On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	Yes
On-board graphics adapter 4K support Indicates whether the device’s integrated graphics adapter can output a 4K resolution (3840×2160) image or video. A value of "Yes" means the hardware and drivers support 4K playback or rendering; "No" indicates that 4K is not supported.	Yes
On-board graphics adapter base frequency The clock speed at which the integrated graphics processor runs under normal conditions, expressed in hertz (Hz). It indicates how many cycles per second the GPU performs and is useful for comparing visual performance across devices that use an on‑board graphics solution.	350 MHz
On-board graphics adapter DirectX version The version number of the DirectX graphics API supported by a device, indicating its graphical capabilities and compatibility with software that relies on specific DirectX features.	12.0
On-board graphics adapter dynamic frequency The operating speed at which the integrated graphics processor in a device runs, expressed in hertz (Hz). It indicates how many cycles per second the GPU can perform and is used to assess visual performance, power consumption, and compatibility with display refresh rates.	1200 MHz
On-board graphics adapter ID The unique identifier of the integrated graphics adapter built into a device, typically expressed as a hexadecimal string such as "0x5916" or a numeric code like "1916". This value allows users and systems to distinguish between different GPU models and versions across laptops, desktops, and motherboards.	0x3E92
On-board graphics adapter maximum resolution (eDP - Integrated Flat Panel)	4096 x 2304 pixels
On-board graphics adapter model The model name or number of the integrated graphics adapter built into a device, such as a laptop or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	Intel® UHD Graphics 630
On-board graphics adapter outputs supported A comma‑separated list of the video output ports that an integrated or onboard graphics adapter can provide, such as DisplayPort, HDMI, DVI, VGA, or Embedded DisplayPort (eDP). The values indicate which external displays can be connected directly to the device without additional adapters.	DisplayPort,Embedded DisplayPort (eDP),HDMI
On-board graphics adapter refresh rate at maximum resolution (DisplayPort) The highest refresh rate that the integrated graphics adapter can output at its maximum supported resolution over a DisplayPort connection. It indicates how many times per second the image is refreshed on the display, affecting motion smoothness and visual quality.	60 Hz
Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.	116 mm
Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.	101 mm
Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.	70 mm
PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.	3.0
PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.	1x16,1x8+2x4,2x8
Processor ARK ID The unique numeric identifier assigned by Intel to each processor model, used for precise identification and lookup of technical specifications.	126686
Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.	4.6 GHz
Processor brand name The name of the company that designs and produces the central processing unit used in a device, such as Intel, AMD or Qualcomm. It identifies the manufacturer so users can quickly see which brand’s processors are supported by the product.	8th Gen Intel Core i78th Gen Intel Core i7 Processor
Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.	Smart Cache
Processor codename	Coffee Lake
Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.	8th gen Intel® Core™ i7
Processor lithography The lithography process defines the minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.	14 nm
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.	i7-8700
Processor number The unique model designation of a computer processor, such as "8250U" or "i7-1165G7". It identifies the specific CPU used in a device and can be compared across products to infer performance, generation, and compatibility.	8700
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.	37.5 x 37.5 mm
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.	LGA 1151 (Socket H4)
Product family The maximum clock frequency at which a processor operates, expressed in megahertz (MHz) or gigahertz (GHz). This value indicates the speed of the CPU and allows users to compare performance across different models.	Intel Core Processors
Status	Launched
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.	AVX 2.0,SSE4.1,SSE4.2
Thermal design power The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.	65 W
Thermal monitoring technologies	Yes
Thermal solution specification A short alphanumeric code that identifies the thermal solution or cooling configuration used in a computer component such as a processor, motherboard, or chassis. The identifier is typically assigned by the manufacturer and can be referenced to determine compatibility, performance characteristics, or warranty information for the cooling system.	PCG 2015C