Intel Celeron G550 Processor

Intel (5032037043410 / BX80623G550) - Box - Enhanced intel speedstep technology - Execute disable bit - Idle states - Intel 64 - Intel Dual Display Capable Technology - Intel enhanced halt state - Intel Fast Memory Access

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Intel Celeron G550 Processor

Overview

The Intel Celeron G550 is a dual‑core desktop processor that debuted in the second quarter of 2012 as part of Intel’s Sandy Bridge architecture. Designed for entry‑level systems, it delivers solid performance for everyday computing tasks while maintaining low power consumption and thermal output.

Key Specifications

  • Core Count: 2 cores, 2 threads (no Hyper‑Threading)
  • Base Clock: 2.60 GHz
  • Lithography: 32 nm process technology
  • Cache: 2 MB Smart Cache
  • Socket: LGA 1155 (Socket H2)
  • Tcase: 69.1 °C
  • Power Consumption: 65 W TDP
  • Instruction Set: SSE4.1 / SSE4.2, Intel® 64, Intel® XD bit (Execute Disable)
  • Memory Support: Dual‑channel DDR3‑SDRAM up to 1600 MHz, maximum 32 GB
  • Integrated Graphics: Intel® HD Graphics with a base frequency of 850 MHz
  • Bus Interface: DMI 5 GT/s (PCI Express 2.0)
  • Manufacturing Process: 32 nm, Smart Cache architecture

Performance Characteristics

The G550’s 2.60 GHz base frequency provides a responsive experience for web browsing, office productivity, and media playback. Its dual‑channel memory configuration allows efficient data transfer between the CPU and RAM, while support for DDR3 up to 1600 MHz ensures compatibility with a wide range of motherboards.

With Intel’s Enhanced SpeedStep technology, the processor dynamically adjusts its clock speed and voltage to balance performance and power usage. This feature is complemented by Intel® Power Management, which includes enhanced halt states and idle state support for further energy savings.

Integrated Graphics Capabilities

The built‑in Intel® HD Graphics core offers basic 2D/3D acceleration suitable for casual gaming, video streaming, and graphic design tasks. The 850 MHz base frequency provides sufficient bandwidth for standard display resolutions, while the architecture supports multiple displays through Intel’s Dual Display Capability.

Memory and I/O Support

The processor’s dual‑channel DDR3 interface can handle up to 32 GB of RAM, making it suitable for multitasking environments. The DMI bus operating at 5 GT/s facilitates communication between the CPU and peripheral components such as storage controllers and PCI Express devices.

Security Features

Although the G550 does not include Intel® Trusted Execution Technology or Hyper‑Threading, it incorporates the Execute Disable Bit (XD), a hardware-based security feature that prevents execution of malicious code in non-executable memory regions. Additionally, the processor supports Intel’s Fast Memory Access and Flex Memory Access technologies to optimize data flow between CPU and RAM.

Thermal Management

The 65 W TDP combined with a maximum case temperature of 69.1 °C ensures that the G550 operates within safe thermal limits in typical desktop environments. The processor’s integrated thermal monitoring allows the system firmware to adjust fan speeds and power states to maintain optimal temperatures.

Use Cases

The Intel Celeron G550 is ideal for:

  • Home PCs: Everyday tasks such as web browsing, document editing, and media consumption.
  • Office Workstations: Light multitasking with office suites and email clients.
  • Media Centers: Streaming video and audio without the need for high‑end graphics performance.
  • Budget Gaming Setups: Entry‑level titles that rely more on CPU than GPU power.

Conclusion

The Intel Celeron G550 remains a reliable choice for users seeking a cost‑effective, low‑power processor capable of handling everyday computing demands. Its balanced combination of dual cores, integrated graphics, and efficient memory support makes it well suited for a wide range of desktop applications.


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- Processors for computers
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Colors
Predominant colors of the product
Tags Intel Celeron G550 Socket 1155
Identifiers
Brand Intel

Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.
Model Intel BX80623G550
MPN Intel BX80623G550
ID 8528231
Dimensions / Weight
Key Features
Box
Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.
Yes
Bus bandwidth
The maximum frequency at which a system bus can transfer data, expressed in hertz (Hz). It indicates the theoretical throughput capability of the bus and allows users to compare performance across different processors or components.
5
Bus Type
The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
DMI
Bus type units
The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.
GT/s
Cache memory
The amount of internal memory reserved as a cache within a device or component, expressed in a data size such as megabytes (MB) or gigabytes (GB). It represents the temporary storage used to accelerate read/write operations by holding frequently accessed data closer to the processor or controller.
2 MB
Component for
Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
PC
Embedded options available
Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
No
Enhanced intel speedstep technology Yes
Execute disable bit
Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.
Yes
Idle states
A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.
Yes
Intel 64
Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.
Yes
Intel Dual Display Capable Technology
Indicates whether the product can simultaneously drive two independent displays, allowing users to extend or duplicate visual output across multiple screens.
Yes
Intel enhanced halt state
Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.
Yes
Intel Fast Memory Access
Indicates whether the product supports Intel’s Fast Memory Access feature, which allows the processor to access system memory more quickly and efficiently for improved performance.
Yes
Intel FDI Technology
Indicates whether the product incorporates Intel’s Flexible Display Interface (FDI) technology, which enables high‑bandwidth video output and efficient power management for display connections.
Yes
Intel flex memory access
Indicates whether the product supports Intel’s flexible memory access feature, which allows dynamic allocation and sharing of memory resources between the CPU and other components to improve performance and power efficiency.
Yes
Intel trusted execution technology
Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.
No
Launch date
The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.
Q2'12
Market segment
The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
DT
Maximum internal memory
The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
32768 MB
Maximum internal memory supported by processor
The largest amount of internal random‑access memory (RAM) that a processor can address and support, expressed as a data size such as megabytes or gigabytes. It indicates the upper limit of memory capacity for active processes and multitasking performance on devices using this CPU.
32 GB
Memory channels
The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
Dual-channel
Memory clock speeds supported by processor
The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.
1600 MHz
Memory types supported by processor
A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.
DDR3-SDRAM
On-board graphics adapter
The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
Yes
On-board graphics adapter base frequency
The clock speed at which the integrated graphics processor runs under normal conditions, expressed in hertz (Hz). It indicates how many cycles per second the GPU performs and is useful for comparing visual performance across devices that use an on‑board graphics solution.
850 MHz
On-board graphics adapter model
The model name or number of the integrated graphics adapter built into a device, such as a laptop or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
Intel® HD Graphics
Package depth
The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.
114 mm
Package Height
The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.
102 mm
Package width
The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.
81 mm
PCI Express CEM Revision
The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.
2.0
Processor ARK ID
The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.
53418
Processor brand name
The name of the company that designs and produces the central processing unit used in a device, such as Intel, AMD or Qualcomm. It identifies the manufacturer so users can quickly see which brand’s processors are supported by the product.
Intel Celeron
Processor cache type
The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.
Smart Cache
Processor codename Sandy Bridge
Processor frequency
The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.
2.6 GHz
Processor manufacturer
The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.
Intel
Processor model
Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
G550
Processor operating modes
The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute indicates the architectural mode(s) supported by the CPU and helps users determine compatibility with software that requires a specific bitness.
64-bit
Processor package size
The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
37.5 x 37.5 mm
Processor series
The processor series identifies the family or generation of a CPU, such as "Intel Xeon E5-2600" or "AMD Ryzen 5000". It is used to group models that share similar architecture, performance characteristics and compatibility features.
Intel Celeron Processor G500 series for Desktop
Processor socket
The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.
LGA 1155 (Socket H2)
Product family
The maximum clock frequency at which a processor operates, expressed in megahertz (MHz) or gigahertz (GHz). This value indicates the speed of the CPU and allows users to compare performance across different models.
Intel Celeron Processor
Product name
The physical connector type used by a processor, motherboard or other component to interface with its platform, such as LGA1151, Socket AM4, LGA1200, etc. This attribute helps users determine compatibility between CPUs and motherboards.
Intel Celeron G550 (2M Cache, 2.60 GHz)
Product Type
Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.
Processor
Status Discontinued
Supported instruction sets
A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
SSE4.1/4.2
Tcase
Valor que indica la temperatura a la cual el producto opera o se mantiene durante su uso normal. Se expresa en grados Celsius, Fahrenheit o Kelvin según el contexto del fabricante y permite comparar condiciones térmicas entre dispositivos similares.
69.1 °C
Thermal monitoring technologies Yes

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