Intel DBS2600CW2SR Server Board Green

Intel (5032037081818 / DBS2600CW2SR) - Rack or Pedestal - Server - Supported - Fast Ethernet,Gigabit Ethernet - VGA - Serial ATA III - E5-2600 - Q1'16 - SRV - Octa-channel - Intel® C612 - SSI EEB - Intel

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Intel DBS2600CW2SR Server Board Green

The Intel DBS2600CW2SR Server Board Green is a high‑performance, dual‑socket server motherboard engineered for demanding enterprise workloads. Designed around the Intel C612 chipset and compatible with the E5‑2600 v3/v4 Xeon series, this board delivers exceptional scalability, reliability, and flexibility for modern data centers.

Form Factor & Physical Dimensions

Form Factor: SSI EEB (12" x 13") – ideal for both rack‑mount and pedestal installations.
Package Size: Width 367 mm, Height 67 mm, Depth 323 mm.
Chassis Compatibility: Rack or Pedestal.
Fan Connectors: 7 dedicated chassis fan headers for optimal airflow management.

Processor & CPU Support

Socket Type: LGA 2011 (Socket R) – supports up to two Intel Xeon E5‑2600 v3/v4 processors.
QPI Links: 2, enabling high‑bandwidth interprocessor communication.
Processor Manufacturer: Intel.

Memory Architecture

DIMM Slots: 16 dual‑rank DDR4 slots, supporting octa‑channel memory configuration.
Maximum Memory Capacity: 1 TB (1024 GB) per board.
Supported Memory Speeds: 1600, 1866, and 2133 MHz DDR4‑SDRAM.
Memory Voltage: 1.2 V.
ECC Support: Yes – error‑correcting code memory for data integrity.

Storage & I/O Interfaces

SATA Connectors: 10 × SATA III (6 Gb/s) ports, all hot‑plug capable.
PCI Express Lanes: Up to 84 lanes (Gen 3.0), supporting multiple expansion cards and high‑speed storage solutions.
PCIe Slots: Multiple Gen 3.0 slots for GPUs, NICs, or NVMe SSDs.
USB Ports: 2 × USB 2.0 (Gen 1) ports; additional USB 3.2 Gen 1 available via PCIe expansion.
VGA Output: 1 × D‑Sub VGA port for basic display connectivity.

Networking & Connectivity

Ethernet Interfaces: Integrated Fast Ethernet (10/100 Mbps) and Gigabit Ethernet (1 Gbps).
LAN Support: Yes – ideal for server clusters and high‑throughput environments.

Security & Reliability Features

Intel Trusted Execution Technology (TXT): Provides hardware‑based root of trust for secure boot and virtualization.
TPM Connector: Supports a TPM module for encrypted storage and secure key management.
RAID Support: Hardware RAID levels 0, 1, 10 – enabling flexible data protection schemes.

Power & Thermal Management

Thermal Design Power (TDP): 145 W – balanced for performance and energy efficiency.
Integrated Fan Control: Multiple fan headers allow fine‑tuned cooling profiles.

Software & Management

Quick Installation Guide: Included – simplifies deployment and configuration.
Intel Flex Memory Access: Enables dynamic memory bandwidth allocation for optimal performance.
Intel Fast Memory Access: Reduces latency between CPU and memory, boosting throughput.

Launch & Market Positioning

Launch Date: Q1 2016 – part of Intel’s S2600CW series targeting enterprise servers.
Market Segment: Server (SRV) – designed for high‑density, mission‑critical workloads.

Key Takeaways

The Intel DBS2600CW2SR Server Board Green combines a robust dual‑socket architecture with extensive memory and I/O capabilities. Its support for ECC memory, Intel TXT, and TPM ensures data integrity and security, while the generous PCIe lane count and SATA connectivity provide ample expansion options. Whether deployed in a rack or pedestal chassis, this board delivers reliable performance for demanding server applications.

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Identifiers
Brand	Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.
Model	Intel DBS2600CW2SR
MPN	Intel DBS2600CW2SR
ID	8960266
Dimensions / Weight
Key Features
Chassis type The physical configuration or shape of a computer chassis, such as tower, rack‑mount (e.g., 1U, 2U), desktop, mini‑PC, or other compact designs. It indicates the overall size and mounting style that determines compatibility with motherboards, power supplies, and case accessories.	Rack or Pedestal
Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.	Server
Discrete graphics adapter model	Supported
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.	Yes
ECC supported by processor Indicates whether the processor in a device supports Error Correcting Code (ECC) memory, allowing detection and correction of single-bit errors during data storage or transfer.	Yes
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.	No
Ethernet interface type A list of the Ethernet standards that a product supports, such as Fast Ethernet (10/100 Mbps), Gigabit Ethernet (1 Gbps), 2.5 GbE, 10 GbE, and other variants. Each value is a free‑text label describing one supported interface; multiple values are separated by commas when the device offers more than one speed or generation.	Fast Ethernet,Gigabit Ethernet
Ethernet LAN Indicates whether the product includes an Ethernet LAN interface for wired network connectivity, allowing data transmission over RJ‑45 or compatible cables.	Yes
Form Factor Specifies the physical configuration or design of a product, such as ATX, Micro‑ATX, Mini‑ITX, tower, case with cover, etc. It describes how the device is built and what mounting or expansion options it supports.	SSI EEB 12" x 13"
Graphics output A list of the video output connectors and protocols that a device can provide for transmitting visual signals, such as HDMI, DisplayPort, VGA, or USB‑C based outputs. Each entry indicates a distinct connector type or version (e.g., "HDMI 2.1", "DP 1.4"). This attribute helps users identify which displays or external devices the product can support.	VGA
HDD interface List of the physical interface(s) used by a hard drive together with the number of bays it occupies, such as "2 x SATA (2 x Bay)" or "1 x M.2 PCIe". This attribute helps users determine both the connection type and how many drives can be installed in an enclosure or system.	Serial ATA III
Intel Fast Memory Access Indicates whether the product supports Intel’s Fast Memory Access feature, which allows the processor to access system memory more quickly and efficiently for improved performance.	Yes
Intel flex memory access Indicates whether the product supports Intel’s flexible memory access feature, which allows dynamic allocation and sharing of memory resources between the CPU and other components to improve performance and power efficiency.	Yes
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.	Yes
Intel Xeon series The specific model identifier of an Intel Xeon processor, such as E5‑2600 or E3‑1200. This value allows users to determine compatibility with motherboards, operating systems, and other hardware components.	E5-2600
Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.	Q1'16
Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.	SRV
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.	1024 GB
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed communication channels that can be used simultaneously for peripherals such as graphics cards, storage devices, and networking adapters.	84
Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.	Octa-channel
Memory voltage The electrical voltage required by the RAM modules of a device, expressed in volts (V). It indicates the operating supply voltage that the memory needs to function correctly and safely.	1.2 V
Motherboard chipset The model of the motherboard’s chipset, indicating the family of supported processors and integrated features such as I/O interfaces, memory support, and peripheral connectivity.	Intel® C612
Motherboard form factor The physical layout and size classification of a motherboard, such as ATX, Micro‑ATX, Mini‑ITX, or other standardized formats. It indicates the dimensions, mounting points, and expansion capabilities that determine compatibility with computer cases and components.	SSI EEB
Number of chassis fan connectors The total count of electrical connectors on a computer chassis that accept cooling fans. This value indicates how many separate fan units can be attached to the case for airflow management, allowing users to assess cooling capacity and compatibility with their system.	7
Number of DIMM slots The count of physical memory slots available on a device for installing RAM modules. It indicates how many separate memory sticks can be installed or upgraded.	16
Number of Processors Supported The total count of CPU units that a computer system or component can accommodate or run simultaneously. It indicates how many separate processor chips are installed, supported by the motherboard or chassis, and is useful for understanding multi‑core or multi‑CPU configurations.	2
Number of SATA connectors The total count of physical SATA connectors available on the product. It indicates how many separate SATA ports are present, regardless of version or type, allowing users to assess storage expansion capacity.	10
On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	Yes
Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.	323 mm
Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.	67 mm
Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.	367 mm
PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.	3.0
Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.	Intel
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.	LGA 2011 (Socket R)
Product family The maximum clock frequency at which a processor operates, expressed in megahertz (MHz) or gigahertz (GHz). This value indicates the speed of the CPU and allows users to compare performance across different models.	Dual-socket server board
Product series	Intel S2600CW
Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.	Server/Workstation Board
Quick installation guide Indicates whether a quick‑installation guide is provided with the product. A value of "Yes" means that a brief, step‑by‑step manual or overview is included to help users set up the device quickly; "No" indicates that no such guide is supplied.	Yes
RAID levels A comma‑separated list that specifies the RAID configurations supported by a storage controller or device. Each entry can be a numeric level (e.g., 0, 1, 5, 10) or a special label such as JBOD. This attribute indicates which disk arrangements the system can manage.	0,1,10
RAID support A comma‑separated list of RAID levels that a storage device or controller can support, such as 0, 1, 5, 10, JBOD, and other proprietary configurations. Each value represents a distinct RAID mode the system is capable of creating or managing.	Yes
Status	Launched
Supported memory clock speeds The operating frequencies that a processor or memory module can run at, expressed in megahertz (MHz) or gigahertz (GHz). This attribute lists all supported clock rates, allowing users to understand the performance range of the component.	1600,1866,2133 MHz
Supported memory types A list of the memory module types that a device can accept or support, such as DDR4 SDRAM, LPDDR3, or other RAM technologies. Each entry represents a distinct memory architecture or generation compatible with the product.	DDR4-SDRAM
Thermal power The amount of electrical power, expressed in watts (W), that a device consumes or is designed to dissipate as heat during normal operation. It represents the typical energy draw of the product and can be used to estimate operating costs, compare efficiency, or assess cooling requirements.	145 W
TPM connector Indicates whether the product includes a physical port that can accept a Trusted Platform Module (TPM) chip, enabling hardware‑based security features such as secure boot and encrypted storage.	Yes
USB 2.0 connectors The total number of physical USB 2.0 ports available on a product. This value indicates how many separate USB 2.0 interfaces can be used for connecting peripherals such as keyboards, mice, storage devices or other accessories.	1
USB Version The specific version of the USB standard that a product supports, expressed as a generation number and optional descriptive suffix (e.g., "3.2 Gen 1" or simply "3.0"). This attribute indicates the data‑transfer capabilities and compatibility with USB devices.	2.0/3.2 Gen 1 (3.1 Gen 1)
Wi-Fi Indicates whether the product has built‑in Wi‑Fi capability, allowing it to connect to wireless networks without requiring external adapters or dongles.	No