Intel Xeon E5-2670V3 Processor
Intel (0606921526874 / BX80644E52670V3) - Bus bandwidth: 9.6 - Intel Identity Protection Technology version: 0.00 - Intel Secure Key Technology version: 1
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Intel Xeon E5-2670V3 Processor
The Intel Xeon E5‑2670V3 is a high‑performance server and workstation processor that embodies Intel’s Haswell architecture, delivering robust compute power for demanding enterprise workloads. Designed for the LGA 2011‑v3 socket, it offers 12 physical cores and 24 threads, enabling simultaneous multitasking across large data sets.
Core Architecture & Performance
Built on a 22 nm lithography process, the processor features 12 cores with Intel’s Hyper‑Threading technology, allowing each core to handle two threads concurrently. The base clock frequency is set at 2.3 GHz, while Turbo Boost extends performance up to 3.1 GHz under optimal thermal and power conditions.
The CPU incorporates a large 30 MB Smart Cache, which intelligently distributes cache resources across cores for maximum efficiency. This cache is shared among all 12 cores, reducing memory latency and improving throughput for compute‑intensive applications such as virtualization, scientific simulations, and database engines.
Memory & I/O Capabilities
The processor supports quad‑channel DDR4‑SDRAM, with memory clock speeds ranging from 1600 MHz to 2133 MHz. It can address up to 768 GB of system memory, a critical feature for large in‑memory databases and high‑performance analytics.
For I/O, the Xeon E5‑2670V3 offers robust PCI Express support. It provides up to 40 PCIe lanes with configurations available at x4, x8, or x16, all operating under the PCIe 3.0 standard. This allows for high bandwidth connectivity to GPUs, NVMe SSDs, and other expansion cards.
The processor also features a 9.6 GT/s QPI (QuickPath Interconnect) bus, enabling fast communication between multiple CPUs in multi‑socket systems. The QPI link count is two, facilitating scalable server architectures.
Advanced Features & Security
The Xeon E5‑2670V3 includes a suite of Intel technologies designed for reliability and security:
- Intel® Secure Key Technology v1.00 – hardware random number generation.
- Intel® Trusted Execution Technology (TXT) – ensures a secure boot process.
- Intel® Identity Protection Technology v0.00 – protects against identity theft.
- Intel® Demand‑Based Switching – dynamically adjusts power consumption based on workload.
- Intel® Enhanced SpeedStep (EES) – fine‑grained frequency scaling for energy efficiency.
- Intel® Hyper‑Threading Technology – doubles thread count per core.
- Intel® AVX2 instruction set – advanced vector extensions for high‑performance computing.
- Execute Disable Bit (XD) – protects against buffer overflow attacks.
- Enhanced Halt State (EHS) and Intel® Idle States – reduce power when the CPU is idle.
Thermal & Power Characteristics
The processor operates within a voltage range of 0.65 V to 1.3 V, with a typical thermal design power (TDP) of 120 W. The case temperature (Tcase) is specified at 84.5 °C, indicating the maximum safe operating temperature for the package.
Scalability & Market Positioning
The Xeon E5‑2670V3 is part of Intel’s E5‑2600 v3 family, targeting the server (SRV) market segment. It supports a two‑socket scalability model (2S), allowing for high core counts in enterprise servers.
With its combination of core density, memory bandwidth, and advanced security features, this processor is ideal for workloads such as virtualization, cloud infrastructure, big data analytics, and high‑performance computing clusters.
Key Specifications Summary
| Feature | Specification |
|---|---|
| Socket | LGA 2011‑v3 |
| Cores / Threads | 12 / 24 |
| Base Frequency | 2.3 GHz |
| Turbo Boost | 3.1 GHz |
| Cache | 30 MB Smart Cache |
| Memory Type | DDR4‑SDRAM (Quad‑channel) |
| Max Memory | 768 GB |
| PCIe Lanes | Up to 40 (x4/x8/x16) |
| QPI Links | 2 @ 9.6 GT/s |
| Instruction Sets | AVX‑2.0, Intel® TSX‑NI (not supported) |
| Security Features | TXT, Secure Key, Identity Protection, XD Bit |
| TDP | 120 W |
| Launch Quarter | Q3 2014 |
The Intel Xeon E5‑2670V3 remains a cornerstone for enterprises requiring reliable, scalable compute power. Its blend of high core count, extensive memory support, and advanced security features makes it an enduring choice for modern data centers and professional workstations.
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- Processors for computers |
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| Tags | Processor Xeon processor Intel processor Intel Xeon processor Processor Intel Xeon Processor Xeon Processor LGA2011-v3 Processor Intel Processor Core E5-2670V3 processor 2.3 GHz processor 30 MB Cache processor LGA2011-v3 Socket processor Xeon E5-2670V3 processor Intel 2.3 GHz processor Intel 30 MB Cache processor Intel LGA2011-v3 Socket processor Xeon 2.3 GHz processor Xeon 30 MB Cache processor E5-2670V3 2.3 GHz processor E5-2670V3 30 MB Cache processor Processor E5-2670V3 Processor 2.3 GHz Processor 30 MB Cache Processor LGA2011-v3 Socket Processor 2.3 Processor 30 MB Processor GB Processor MHz Processor Thread Processor Clock Processor Voltage Processor Heat Processor Power Processor Speed |
| Identifiers | |
| Brand |  Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company. |
| Model | Intel BX80644E52670V3 |
| MPN | Intel BX80644E52670V3 |
| ID | 1956678 |
| Dimensions / Weight | |
| Key Features | |
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Box Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.
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No |
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Bus bandwidth The maximum frequency at which a system bus can transfer data, expressed in hertz (Hz). It indicates the theoretical throughput capability of the bus and allows users to compare performance across different processors or components.
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9.6 |
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Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
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QPI |
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Bus type units The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.
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GT/s |
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Cache memory The amount of internal memory reserved as a cache within a device or component, expressed in a data size such as megabytes (MB) or gigabytes (GB). It represents the temporary storage used to accelerate read/write operations by holding frequently accessed data closer to the processor or controller.
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30 MB |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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Server/Workstation |
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ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
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Yes |
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Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
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No |
| Enhanced intel speedstep technology | Yes |
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Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.
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Yes |
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Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.
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Yes |
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Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.
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Yes |
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Intel Demand Based Switching Indicates whether the product incorporates Intel’s Demand‑Based Switching technology, which dynamically adjusts power delivery to components based on workload demands, improving energy efficiency and performance.
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Yes |
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Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.
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Yes |
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Intel flex memory access Indicates whether the product supports Intel’s flexible memory access feature, which allows dynamic allocation and sharing of memory resources between the CPU and other components to improve performance and power efficiency.
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No |
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Intel Identity Protection Technology version Indicates the specific version number of Intel’s Identity Protection Technology that a product supports or implements. The value is typically a numeric string such as "1.00" or "0.00", representing the major and minor revision of the feature set.
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0.00 |
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Intel Secure Key Technology version The specific version number of Intel Secure Key technology supported by the processor, indicating the generation and capabilities of the secure key feature set.
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1.00 |
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Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.
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Yes |
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Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.
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No |
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Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.
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Q3'14 |
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Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
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SRV |
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Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
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786432 MB |
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Maximum internal memory supported by processor The largest amount of internal random‑access memory (RAM) that a processor can address and support, expressed as a data size such as megabytes or gigabytes. It indicates the upper limit of memory capacity for active processes and multitasking performance on devices using this CPU.
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768 GB |
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Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed communication channels that can be used simultaneously for peripherals such as graphics cards, storage devices, and networking adapters.
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40 |
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Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
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Quad-channel |
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Memory clock speeds supported by processor The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.
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1600,1866,2133 MHz |
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Memory types supported by processor A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.
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DDR4-SDRAM |
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Number of QPI links The total count of Quick Path Interconnect (QPI) connections present in a processor or motherboard. This value indicates how many QPI links are available for high‑speed communication between CPUs, memory controllers, or other components. It is a simple integer that helps users compare interconnect capabilities across different models.
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2 |
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On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
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No |
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PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.
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x4, x8, x16 |
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Processor ARK ID The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.
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81709 |
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Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
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3.1 GHz |
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Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.
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Smart Cache |
| Processor codename | Haswell |
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Processor cores The total number of physical processing units in a single central processing unit (CPU). This value indicates how many independent tasks the CPU can handle simultaneously, influencing multitasking and parallel performance.
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12 |
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Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
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Intel Xeon E5 v3 |
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Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.
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2.3 GHz |
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Processor lithography The lithography process defines the minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.
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22 nm |
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Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.
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Intel |
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Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
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E5-2670V3 |
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Processor operating modes The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute indicates the architectural mode(s) supported by the CPU and helps users determine compatibility with software that requires a specific bitness.
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64-bit |
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Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
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52.5 x 45 mm |
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Processor series The processor series identifies the family or generation of a CPU, such as "Intel Xeon E5-2600" or "AMD Ryzen 5000". It is used to group models that share similar architecture, performance characteristics and compatibility features.
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Intel Xeon E5-2600 v3 |
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Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.
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LGA 2011-v3 |
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Processor threads The number of independent execution units (threads) that a processor can handle simultaneously. This value indicates how many parallel tasks the CPU can process at once, which affects multitasking performance and workload distribution.
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24 |
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Product name The physical connector type used by a processor, motherboard or other component to interface with its platform, such as LGA1151, Socket AM4, LGA1200, etc. This attribute helps users determine compatibility between CPUs and motherboards.
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Intel Xeon E5-2670 v3 (30M Cache, 2.30 GHz) |
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Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.
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Processor |
| Status | Launched |
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Stepping Der CPU‑Stepping bezeichnet die interne Version eines Prozessormodells, die bei jeder neuen Fertigungsrunde geändert wird. Er gibt an, welche Revision des Chips verwendet wurde und kann Einfluss auf Leistung, Energieverbrauch oder Kompatibilität haben.
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M1 |
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Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
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AVX 2.0 |
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Tcase Valor que indica la temperatura a la cual el producto opera o se mantiene durante su uso normal. Se expresa en grados Celsius, Fahrenheit o Kelvin según el contexto del fabricante y permite comparar condiciones térmicas entre dispositivos similares.
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84.5 °C |
| Thermal monitoring technologies | Yes |
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VID voltage range The range of electrical voltage that a CPU can safely accept from its power source, expressed in volts (V). It indicates the minimum and maximum supply voltages compatible with the processor, covering both AC and DC inputs where applicable.
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0.65 - 1.3 V |
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