High‑performance thermal interface material in a compact 24 mm × 12 mm size, featuring graphene‑enhanced conductivity and a 0.2 mm thickness for efficient heat transfer between components.
High‑performance thermal interface material in a compact 24 mm × 12 mm size, featuring graphene‑enhanced conductivity and a 0.2 mm thickness for efficient heat transfer between components.
High‑performance thermal interface material in a compact 24 mm × 12 mm size, featuring graphene‑enhanced conductivity and a 0.2 mm thickness for efficient heat transfer between components.
High-performance graphene-enhanced thermal pad, 50 × 50 mm with 0.2 mm thickness, designed for efficient heat transfer between components and heatsinks in electronics.
High-performance graphene-enhanced thermal pad, 50 × 50 mm with 0.2 mm thickness, designed for efficient heat transfer between components and heatsinks in electronics.
High-performance graphene-enhanced thermal pad, 50 × 50 mm with 0.2 mm thickness, designed for efficient heat transfer between components and heatsinks in electronics.
Self-adhesive silicone thermal pad for cooling computer and console heating elements, 120mm x 20mm x 1mm in size.
Silicone thermal pad with self-adhesive properties, conducting heat to cool computer and console heating elements effectively.
Silicone-based thermal pad, self-adhesive and thermally conductive, for cooling computer or console heating elements, measuring 120mm x 20mm x 0.5mm.
Enhance cooling performance with the Thermal Grizzly Carbonaut Thermal Pad, featuring superior heat transfer and flexibility for easy installation in high-performance computing applications.
Enhance cooling performance with the Thermal Grizzly Carbonaut Thermal Pad, featuring superior heat transfer and flexibility for easy installation in high-performance computing applications.
Enhance cooling performance with the Thermal Grizzly Carbonaut Thermal Pad, featuring superior heat transfer and flexibility for easy installation in high-performance computing applications.
