Samsung 16 GB Internal RAM Memory

Overview of the Samsung M393B2G70DB0-YK0 16 GB DDR3 ECC Registered DIMM

The SAMSUNG M393B2G70DB0-YK0 is a high‑performance, enterprise‑grade memory module designed for servers and workstations that demand reliability and scalability. It delivers 16 GB of DDR3 SDRAM in a single 240‑pin DIMM package, featuring Registered (buffered) ECC technology to ensure data integrity across large memory configurations.

Key Technical Specifications

• Capacity: 16 GB per module (1 x 16 GB)
• Speed: DDR3-1600 MHz (PC3L‑12800R) with a clock rate of 800 MHz
• CAS Latency: 11
• Row Cycle Time: 11 ns
• Refresh Row Cycle Time: 11 ns
• Voltage: 1.35 V (low‑power operation)
• Form Factor: 240‑pin DIMM, 30 mm height, 133.3 mm width, 4 mm depth
• Operating Temperature Range: 0 °C to 85 °C
• Memory Type: DDR3 SDRAM with Registered (buffered) ECC
• Compliance: RoHS certified, ensuring environmentally responsible manufacturing

Registered (Buffered) ECC Technology Explained

The Registered feature places a buffer between the memory controller and the DRAM chips. This reduces electrical load on the controller, allowing for higher density modules in multi‑rank configurations without compromising signal integrity.

ECP (Error Correcting Protocol) adds an additional layer of protection by detecting and correcting single‑bit errors and flagging double‑bit errors. In mission‑critical environments—such as database servers, virtualization hosts, or high‑performance computing clusters—this capability is essential for maintaining data consistency and preventing corruption.

Performance Characteristics

At 1600 MHz, the module offers a theoretical bandwidth of up to 12.8 GB/s per rank. With a CAS latency of 11, it balances speed with low access time, making it suitable for workloads that require both large memory pools and rapid data retrieval.

The 1.35 V operating voltage is lower than many older DDR3 modules (which often run at 1.5 V), resulting in reduced power consumption and heat generation—critical factors in dense server racks where thermal headroom is limited.

Physical Design & Compatibility

The module’s dimensions—30 mm height, 133.3 mm width, and 4 mm depth—fit standard 240‑pin DIMM slots found in most enterprise server motherboards. Its single‑rank design simplifies installation while still providing ample capacity for memory‑intensive applications.

Because it is a DDR3-1600 Registered ECC module, it is fully compatible with servers that support DDR3L (low voltage) and require ECC for error detection. It can be paired with other 16 GB modules to scale up memory in increments of 32 GB, 64 GB, or more, depending on the motherboard’s slot count.

Reliability & Longevity

The combination of Registered buffers and ECC ensures that even in high‑density configurations, each bit is verified before being written to memory. This reduces the likelihood of silent data corruption—a common concern in large server deployments.

Manufactured under Samsung’s stringent quality controls, the module undergoes rigorous testing for temperature cycling, electrical stress, and long‑term stability. The RoHS certification further confirms that it meets strict environmental standards, eliminating hazardous substances such as lead, mercury, and cadmium.

Typical Use Cases

• Enterprise Servers: Ideal for Intel Xeon or AMD EPYC platforms where large memory pools are required for virtualization, database hosting, or high‑performance analytics.
• Workstations & Design Systems: Provides the necessary bandwidth and reliability for CAD/CAM, 3D rendering, and scientific simulations.
• High‑Availability Clusters: ECC ensures data integrity across failover scenarios, making it suitable for critical applications that cannot tolerate downtime.

Installation & Configuration Tips

1. Verify that the motherboard supports DDR3L 1.35 V Registered ECC modules.
2. Insert the module at a 45° angle, aligning the notch with the slot key, then gently press until it clicks into place.
3. Enable ECP (ECC) support in the BIOS/UEFI settings to activate error‑checking features.
4. For optimal performance, populate memory slots in pairs or groups that match the motherboard’s rank configuration guidelines.

Conclusion

The Samsung M393B2G70DB0-YK0 16 GB DDR3 ECC Registered DIMM is engineered for environments where capacity, speed, and reliability converge. Its low‑voltage operation, robust error correction, and proven durability make it a cornerstone component for modern server infrastructures that demand uninterrupted performance and data integrity.