20.99 GBP
Team Elite 4Gb Ddr3 1600Mhz No Heatsink
Team Group 4GB DDR3-1600 memory module, 1 x 4 GB, 1600 MHz. TED34G1600C1101 Elite model with no heatsink.
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Team Elite 4GB DDR3 1600MHz Memory Module
The Team Elite 4GB DDR3 1600MHz module is a high‑performance, single‑rank DIMM designed to deliver reliable memory bandwidth for desktop and server platforms. With a capacity of 4096 MB (4 GB), it fits seamlessly into systems that require efficient, low‑latency RAM without the need for additional cooling solutions.
Key Technical Specifications
- Memory Type: DDR3
- Form Factor: 240‑pin DIMM (DIMM)
- Capacity: 4 GB (4096 MB)
- Speed: 1600 MHz (PC3‑12800)
- Latency: CL11 (CAS Latency 11)
- Voltage: 1.5 V
- Non‑ECC, Unbuffered
- RoHS Compliant – meets environmental safety standards
Design and Build Quality
The module features a robust black plastic heat spreader that dissipates heat efficiently while maintaining a slim profile. The absence of a fan or additional heatsink keeps the unit lightweight and quiet, making it ideal for both office workstations and gaming rigs where noise reduction is paramount.
Physical Characteristics
- Dimensions: Standard DIMM size, compatible with all ATX motherboards
- Color: Black (matching most system aesthetics)
- Connector Type: 240‑pin DDR3 socket
Performance Highlights
The 1600 MHz frequency ensures a balanced mix of speed and stability, providing ample bandwidth for multitasking, content creation, and moderate gaming workloads. The CL11 latency offers quick access to data, reducing the time it takes for the memory controller to retrieve information from the module.
Compatibility
- Designed for AMD B550 and other compatible chipsets that support DDR3 memory
- Supports dual‑channel configurations when paired with an identical module, doubling effective bandwidth
- Ideal for systems requiring a single 4 GB DIMM slot or those looking to upgrade from lower capacity modules
Installation and Setup
Installing the Team Elite module is straightforward:
- Power down your system and disconnect all cables.
- Locate an available DDR3 DIMM slot on your motherboard.
- Align the gold contacts of the module with the slot, ensuring the notch matches the keying pin.
- Press firmly until the retention clips snap into place.
- Reconnect power and boot the system; the BIOS should automatically detect the new memory.
Reliability and Longevity
Built with high‑quality components, this module offers:
- Consistent performance over extended periods of use
- Resistance to thermal throttling due to efficient heat spreading
- Durable construction that withstands typical desktop usage patterns
Ideal Use Cases
- Office Productivity: Smooth multitasking with office suites, web browsing, and light media editing.
- Content Creation: Adequate for photo and video editing workflows that do not demand extreme memory capacities.
- Gaming: Supports modern titles at moderate settings when paired with a compatible graphics solution.
- Server Environments: Suitable for low‑end servers or embedded systems where ECC is unnecessary but reliability is required.
Conclusion
The Team Elite 4GB DDR3 1600MHz module delivers dependable performance, solid build quality, and straightforward compatibility for a wide range of desktop and server applications. Its balanced specifications make it an excellent choice for users seeking a reliable memory upgrade without the need for additional cooling or complex configurations.
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Category
This product is cataloged in our store in these categories
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- RAM for computer |
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International
Find this product in one of our international stores
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| Colors
Predominant colors of the product |
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| Tags | Elite 4GB 1600MHz DIMM System Elite 4GB No |
| Identifiers | |
| Brand | Team Group Team Group is a Taiwanese computer hardware company that produces a wide range of products, including memory modules, solid state drives, USB flash drives, and portable hard drives. The company is well-known for its high-quality, reliable products, and its customer service is highly praised. |
| Model | Team Group TED34G1600C1101 |
| MPN | Team Group TED34G1600C1101 |
| ID | 10116903 |
| Dimensions / Weight | |
| Key Features | |
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Capacity The total amount of space or volume that a product can hold, expressed in an appropriate unit such as GB, MB, TB for digital storage or L, ml, cl for liquid capacity. This attribute helps users compare how much content a device or container can accommodate.
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4096 MB |
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Certification A list of official certifications or compliance marks that the product has received from regulatory bodies, safety organizations, or industry standards groups. Each entry represents a distinct certification such as CE, FCC, RoHS, UL, or WEEE, and may include additional details like version numbers or specific test reports.
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RoHS |
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Chipset The chipset is the collection of integrated circuits that manages communication between a computer’s CPU, memory, and peripheral devices. It defines the supported processor families, available I/O interfaces, and overall system capabilities, allowing users to understand compatibility and feature sets for motherboards or other hardware components.
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AMD B550 |
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Chipset manufacturer The company that designs and produces the chipset used in a motherboard or other computer component. This value helps users identify the source of the chipset technology, assess compatibility, support, and performance expectations.
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GPU Support Brace |
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Chipset series The chipset series identifies the family or line of integrated circuits that manage communication between a computer’s CPU, memory, and peripheral devices. It indicates the generation, supported processor families, and key features such as I/O interfaces and connectivity options, helping users assess compatibility and performance across motherboards and other hardware components.
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Accessory |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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PC/server |
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Connection The interface or connector used to connect a device or component to another system. It describes the physical port type (e.g., USB, SATA, HDMI) and any specific variant such as version or pin configuration.
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SATA III |
| Connections | 4-Pin PWM |
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Cooling type The method or mechanism used to dissipate heat from a component such as a processor, graphics card, or other electronic part. It indicates whether the device relies on active cooling (fans or liquid pumps), passive heat sinks, or hybrid solutions, and helps users assess thermal performance and noise levels.
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heatsink |
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DDR Type The classification of the computer’s memory module, such as DDR3, DDR4, DDR5, or variants that include form‑factor information (e.g., SODIMM DDR4). It indicates the technology and compatibility requirements for the device’s motherboard.
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DDR3 |
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Fan Colour The colour or combination of colours that a fan is available in, expressed as common names such as "Black", "White" or comma‑separated lists like "Black, White". It indicates the visual appearance of the fan for consumers.
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Black |
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Fan size The physical diameter of a fan, expressed in millimeters or inches. It indicates the size that determines compatibility with chassis, heatsinks, and mounting brackets.
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120mm |
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Fans The physical dimensions of a fan unit, expressed as the number of fans and their individual diameter in millimetres (e.g., "2 x 120mm"). This attribute helps users understand the cooling capacity and compatibility with cases or other components.
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N/A |
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Form factor Specifies the physical configuration or design of a product, such as ATX, Micro‑ATX, Mini‑ITX, tower, case with cover, etc. It describes how the device is built and what mounting or expansion options it supports.
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DIMM |
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LED Colour The colour or type of LED lighting that a product uses, such as single‑colour LEDs (e.g., Red, Blue), multi‑colour RGB configurations, or addressable RGB systems. The value is expressed as common colour names or descriptive terms and may include multiple entries separated by commas.
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None |
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Memory form factor The physical configuration or size classification of a memory module, such as SO‑DIMM, UDIMM, RDIMM, or on‑board. It indicates the form factor that determines compatibility with motherboards and other hardware components.
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240-pin DIMM |
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Memory slots The number of physical memory slots that are present and available for installing RAM modules in a device. This count indicates how many separate memory sticks can be installed or upgraded.
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2 Slots |
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Packaging The form of packaging used for a product, such as box, blister pack, bag, pallet, or other standard formats that protect and contain the item during shipping and storage.
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Retail |
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Rgb Indicates whether the product includes RGB (Red‑Green‑Blue) lighting or output capability. A value of "Yes" means the device can display or emit RGB light, while "No" indicates no RGB functionality.
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No |
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Speed The maximum speed at which a component or device operates, expressed in an appropriate unit such as revolutions per minute (RPM), hertz (Hz) for frequencies, or other velocity units. It indicates how fast the product can perform its primary function and allows users to compare performance across models.
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1600MHz |
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Type of drive The classification of a storage device installed in or attached to the product, such as solid‑state drive (SSD), hard disk drive (HDD), external SSD, external HDD, or M.2 SSD. It indicates whether the unit is internal or removable and its general technology.
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SSD |





