Hyper X HX429 °C 17FW/16 memory module

Hyper X HX429 °C 17FW/16 Memory Module

The Hyper X HX429 °C 17FW/16 is a high‑performance DDR4 memory module engineered for demanding PC and server environments. With a single 16 GB DIMM, it delivers robust capacity and speed while maintaining strict thermal management through an integrated heatsink.

Key Technical Specifications

• Capacity: 16 GB per module (single‑rank)
• Memory Type: DDR4
• Clock Speed: 2933 MHz (effective)
• CAS Latency: 17
• Voltage: 1.2 V
• Form Factor: 288‑pin DIMM
• Cooling Solution: Integrated heatsink for optimal thermal performance
• Lead Plating: Gold, ensuring reliable electrical contact and corrosion resistance
• Operating Temperature Range: 0 °C to 85 °C (continuous operation)
• Storage Temperature Range: –55 °C to +100 °C (long‑term storage)
• No ECC support, designed for consumer and high‑end workstation use rather than enterprise servers requiring error correction.

Physical Dimensions & Packaging

The module itself measures 34 mm in height and 133.3 mm in width, with a depth of 7.08 mm. Each unit weighs 38.2 g, making it lightweight yet sturdy for dense memory configurations.

The packaging is a tray (Bandeja) that protects the module during shipping and handling. The package dimensions are:

• Height: 171.4 mm
• Width: 57.1 mm
• Depth: 13.9 mm
• Weight of package: 53.9 g (individual) / 1.4 kg (tray)

For bulk distribution, the module is shipped in cartons containing 25 units each, with a pallet holding 5400 modules. Each pallet contains 18 cartons.

Operating System Compatibility

• Windows: Fully supported, enabling seamless integration into mainstream desktop and workstation builds.
• Linux: Compatible with major distributions; the module performs reliably under kernel memory management routines.
• macOS: Supported on compatible hardware platforms that accept DDR4 DIMMs.

Design & Build Quality

The module features a white color scheme, aligning with modern aesthetic preferences for clean, monochrome builds. The gold lead plating enhances durability and ensures consistent signal integrity across high‑frequency data paths.

Its integrated heatsink is engineered to dissipate heat efficiently, maintaining stable operation even under sustained workloads such as video rendering, 3D modeling, or large database processing. This design choice reduces the need for additional cooling solutions in compact systems.

Ideal Use Cases

• High‑Performance Gaming PCs: The 2933 MHz speed and low latency provide a noticeable boost in frame rates and load times.
• Content Creation Workstations: Large memory capacity supports multitasking with demanding applications like Adobe Creative Cloud, Blender, or DaVinci Resolve.
• Server‑Grade Workstations: While not ECC, the module’s reliability and thermal design make it suitable for non-critical server roles where cost efficiency is paramount.
• Overclocking Enthusiasts: The robust build allows users to push frequencies beyond 2933 MHz with careful tuning.

Installation & Compatibility Notes

When installing the Hyper X HX429 °C 17FW/16, ensure that your motherboard supports DDR4 at 2933 MHz and has a compatible 288‑pin DIMM slot. The module’s dimensions fit standard ATX, microATX, and mini‑ITX cases without obstruction.

For optimal performance, pair the module with matching memory sticks of identical specifications to maintain uniform timing and voltage characteristics across all slots.

Conclusion

The Hyper X HX429 °C 17FW/16 stands out as a premium DDR4 memory solution that balances speed, capacity, and thermal efficiency. Its thoughtful design—white aesthetics, gold plating, integrated heatsink—makes it an excellent choice for users seeking reliable performance in both gaming and professional environments.