Intel Core i7 Quad-Core i7-6700 3.4GHz Processor CPU
Quad‑core Intel Core i7‑6700 processor delivers a 3.40 GHz base clock with 8 MB SmartCache, supporting four threads for smooth multitasking and efficient desktop performance
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Intel Core i7‑6700: A Comprehensive Overview
The Intel Core i7‑6700 is a flagship desktop processor from Intel’s 6th generation “Skylake” family, launched in the third quarter of 2015. Designed for high-performance computing, it delivers robust processing power while maintaining energy efficiency and advanced integrated graphics capabilities.
Key Architectural Highlights
- Cores & Threads: 4 physical cores with Hyper‑Threading support, enabling 8 simultaneous threads for multitasking and parallel workloads.
- Base Frequency: 3.40 GHz, with a Turbo Boost capability that scales up to 4.00 GHz under load, ensuring responsive performance in demanding applications.
- Lithography: Built on Intel’s 14 nm process technology, balancing power consumption and transistor density for optimal efficiency.
- Cache Architecture: 8 MB of Smart Cache, comprising 4 × 256 KB L2 caches and an additional 8 MB L3 cache, facilitating rapid data access and reducing memory latency.
- Instruction Set Support: Includes SSE4.1, SSE4.2, AVX2, and other advanced SIMD extensions for accelerated multimedia, scientific, and engineering workloads.
Memory & I/O Specifications
- Supported Memory Types: DDR3L‑SDRAM (1333 MHz, 1600 MHz, 1866 MHz, 2133 MHz) and DDR4‑SDRAM (up to 2400 MHz), offering flexibility for a wide range of motherboards.
- Maximum Memory: 64 GB across dual-channel configurations, enabling large datasets and memory-intensive applications.
- PCI Express Configuration: PCIe 3.0 with up to 16 lanes (1×16 or 2×8 + 1×8 + 2×4), supporting high-bandwidth GPUs, SSDs, and networking cards.
- System Bus: DMI3 interface operating at 8 GT/s, ensuring efficient communication between the CPU and chipset.
Integrated Graphics Capabilities
- GPU Model: Intel® HD Graphics 530, featuring 3 execution units (EUs) for graphics processing.
- Base Frequency: 350 MHz with dynamic scaling up to 1.74 GB of shared memory.
- Display Outputs: Supports eDP, DP, HDMI, and DVI interfaces, allowing connectivity to a variety of monitors.
- Graphics APIs: DirectX 12.0, OpenGL 4.4, and support for video compression formats, enabling smooth media playback and light gaming workloads.
Thermal & Power Management
- TDP (Thermal Design Power):** 65 W, a balanced figure that permits quiet operation while delivering strong performance.
- Cooling Solution: The processor package includes an integrated cooler (PCG 2015C), ensuring adequate heat dissipation out of the box.
- Power Features: Intel® SpeedStep, Enhanced Halt State, and Thermal Monitoring technologies provide dynamic power scaling and temperature awareness for longevity and efficiency.
Security & Reliability Enhancements
- Intel® Secure Key (AES-NI):** Hardware acceleration for encryption tasks.
- Intel® Trusted Execution Technology (TXT):** Provides a secure boot environment and measured launch integrity.
- Execute Disable Bit & TSX‑NI: Advanced memory protection and transactional synchronization support for robust application execution.
Socket & Compatibility
- CPU Socket: LGA 1151 (H4), compatible with a wide range of mainstream desktop motherboards featuring Intel 6th‑generation chipsets.
- Package Dimensions: 37.5 × 37.5 mm, ensuring fitment in standard ATX and micro‑ATX cases.
Ideal Use Cases
- Content Creation: Video editing, 3D rendering, and graphic design benefit from the high core count and AVX2 acceleration.
- Software Development: Compiling large codebases is expedited by Hyper‑Threading and fast memory support.
- Gaming & Multimedia: While not a dedicated GPU, the HD 530 integrated graphics provide satisfactory performance for casual gaming and media consumption.
- Business & Productivity: Office suites, virtualization, and enterprise applications run smoothly thanks to 64‑bit architecture and robust security features.
Conclusion
The Intel Core i7‑6700 stands as a versatile, high-performance processor that blends powerful compute capabilities with efficient power usage. Its advanced cache hierarchy, integrated graphics, and comprehensive feature set make it an excellent choice for professionals seeking reliable performance across a spectrum of demanding tasks.
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| Tags | Processor Lga1151 processor Processor i7 Processor quad-core Intel Core i7 Processor 3.4ghz 3.4ghz processor Processor lga1151 Processor cache Boxed processor Processor 8M Cache I7-6700 Processor boxed Processor FC-LGA14C Lga1155 processor Fc-lga14c processor 8M processor Processor LGA1155 Core i7 Quad-Core I7 3.4GHz Intel i7-6700 I7-6700 FC-LGA14C I7-6700 3.4GHz I7-6700 8M I7-6700 Cache I7-6700 LGA1155 I7-6700 LGA1151 I7-6700 Quad-Core I7-6700 3.40GHz I7-6700 Boxed I7-6700 Processor I7-6700 4 I7-6700 Intel I7-6700 CPU I7-6700 BX80662I76700 |
| Identifiers | |
| Brand |  Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company. |
| Model | Intel BX80662I76700 |
| MPN | Intel BX80662I76700 |
| ID | 4957252 |
| Dimensions / Weight | |
| Key Features | |
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Box Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.
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Yes |
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Bus bandwidth The maximum frequency at which a system bus can transfer data, expressed in hertz (Hz). It indicates the theoretical throughput capability of the bus and allows users to compare performance across different processors or components.
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8 |
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Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
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DMI3 |
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Bus type units The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.
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GT/s |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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PC |
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Cooler included Indicates whether the product comes with a cooling solution included in its package. A value of "Yes" means a cooler (air, liquid, or passive) is supplied; a value of "No" means no cooler is provided and must be purchased separately.
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Yes |
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Core name The designation of the processor core architecture or family, such as "Skylake", "Kaby Lake" or "Vishera". It identifies the specific micro‑architecture used in a CPU and helps users compare performance characteristics across different generations.
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Skylake |
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CPUsocket type The physical connector used by a CPU to attach to a motherboard or compatible platform. It specifies the exact socket designation required for proper installation and compatibility, such as LGA 1151, Socket AM4, or LGA 1200.
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LGA 1151 |
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ECC Indica si el producto cuenta con la característica o función especificada. El valor puede ser "Sí" (disponible) o "No" (no disponible).
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No |
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Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
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Yes |
| Enhanced intel speedstep technology | Yes |
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Execute disable bit Indica si la función de desactivar el bit de ejecución está habilitada en el dispositivo o componente. Un valor afirmativo significa que se permite bloquear la ejecución de código no autorizado, mientras que un valor negativo indica que esta protección no está activa.
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Yes |
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Generation The generation of a central‑processing unit indicates the cohort or family of CPU models that share common architecture, performance characteristics, and feature sets. It is typically expressed as an ordinal number (e.g., "1st Generation", "10th Gen") followed by the manufacturer name and model series, helping users compare processors across brands and time periods.
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6th Generation |
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Graphics & IMC lithography The minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.
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14 nm |
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Graphics output A list of the video output connectors and protocols that a device can provide for transmitting visual signals, such as HDMI, DisplayPort, VGA, or USB‑C based outputs. Each entry indicates a distinct connector type or version (e.g., "HDMI 2.1", "DP 1.4"). This attribute helps users identify which displays or external devices the product can support.
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eDP/DP/HDMI/DVI |
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Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.
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Yes |
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Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.
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Yes |
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Intel clear video technology Indicates whether the product incorporates Intel’s Clear Video HD technology, a hardware feature that enhances video playback and capture quality by providing smoother motion, reduced artifacts, and improved color accuracy.
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Yes |
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Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.
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Yes |
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Intel Identity Protection Technology version Indicates the specific version number of Intel’s Identity Protection Technology that a product supports or implements. The value is typically a numeric string such as "1.00" or "0.00", representing the major and minor revision of the feature set.
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1.00 |
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Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.
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Yes |
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Intel TSX-NI Indicates whether the product incorporates Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI), a hardware feature that enables efficient transaction processing and concurrency control in compatible processors.
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Yes |
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L2 cache The amount of internal memory reserved for a processor’s L2 cache, expressed as a pair of values: the number of banks and the capacity per bank (e.g., "4 x 256 KB"). This format allows specification of both the count of cache banks and the capacity of each bank, which together determine the total L2 cache available to the CPU.
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8192 KB |
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Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.
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Q3'15 |
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Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
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DT |
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Maximum graphics adapter memory The amount of dedicated video memory available on a graphics adapter or GPU, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the GPU can store for textures, frame buffers and other rendering tasks, affecting performance in gaming, 3D applications and high‑resolution displays.
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1740 MB |
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Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
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64 GB |
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Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed communication channels that can be used simultaneously for peripherals such as graphics cards, storage devices, and networking adapters.
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16 |
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Maximum on-board graphics adapter memory The maximum amount of dedicated video memory that the integrated graphics adapter built into a device can provide, expressed as a data size (e.g., megabytes or gigabytes). This value indicates how much graphical processing power is available for rendering, gaming, and other GPU‑intensive tasks.
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1.74 GB |
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Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
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Dual-channel |
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Memory clock speeds supported by processor The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.
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1333,1600,1866,2133 MHz |
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Memory types supported by processor A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.
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DDR3L-SDRAM,DDR4-SDRAM |
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Memory voltage supported by processor The operating voltage required or supplied to the processor, expressed in volts (V). It indicates the electrical potential that powers the CPU and is essential for ensuring proper performance and compatibility with power delivery systems.
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1.35 V |
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On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
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Yes |
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On-board graphics adapter 4K support Indicates whether the device’s integrated graphics adapter can output a 4K resolution (3840×2160) image or video. A value of "Yes" means the hardware and drivers support 4K playback or rendering; "No" indicates that 4K is not supported.
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Yes |
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On-board graphics adapter base frequency The clock speed at which the integrated graphics processor runs under normal conditions, expressed in hertz (Hz). It indicates how many cycles per second the GPU performs and is useful for comparing visual performance across devices that use an on‑board graphics solution.
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350 MHz |
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On-board graphics adapter DirectX version The version number of the DirectX graphics API supported by a device, indicating its graphical capabilities and compatibility with software that relies on specific DirectX features.
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12.0 |
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On-board graphics adapter ID The unique identifier of the integrated graphics adapter built into a device, typically expressed as a hexadecimal string such as "0x5916" or a numeric code like "1916". This value allows users and systems to distinguish between different GPU models and versions across laptops, desktops, and motherboards.
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1912 |
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On-board graphics adapter model The model name or number of the integrated graphics adapter built into a device, such as a laptop or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
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Intel® HD Graphics 530 |
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On-board graphics adapter OpenGL version The specific version of the OpenGL graphics API supported by a device, indicating its rendering capabilities and compatibility with software that relies on this standard.
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4.4 |
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OpenGL support Indicates whether a product supports the OpenGL graphics API and, if so, which version is supported. The value can be "Yes" for basic support or a numeric string such as "4.5" or "4.6" to specify the exact OpenGL version available.
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Yes |
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Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.
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116 mm |
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Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.
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101 mm |
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Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.
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70 mm |
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PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.
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3.0 |
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PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.
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2x8,1x8+2x4,1x16 |
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Processor ARK ID The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.
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88196 |
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Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
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4 GHz |
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Processor brand name The name of the company that designs and produces the central processing unit used in a device, such as Intel, AMD or Qualcomm. It identifies the manufacturer so users can quickly see which brand’s processors are supported by the product.
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Intel Core i7 Intel Core i7 Processor |
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Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.
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Smart Cache |
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Processor code A unique identifier that represents the specific model or variant of a computer processor. The code is typically an alphanumeric string (e.g., "SR2ZU", "SR3LA") used by manufacturers to distinguish between different CPU models, generations, and configurations. It can be entered as free text and may appear in product listings, technical specifications, or inventory records.
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SR2BT |
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Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
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6th gen Intel® Core™ i7 |
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Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.
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Intel |
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Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
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i7-6700 |
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Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
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37.5 x 37.5 mm |
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Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.
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LGA 1151 (Socket H4) |
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Product name The physical connector type used by a processor, motherboard or other component to interface with its platform, such as LGA1151, Socket AM4, LGA1200, etc. This attribute helps users determine compatibility between CPUs and motherboards.
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Intel Core i7-6700 (8M Cache, up to 4.00 GHz) |
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Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.
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Processor |
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Scalability The maximum number of CPU sockets that a product can support. It indicates how many processor units can be installed simultaneously in the system, which affects overall processing capacity and scalability.
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1S |
| Status | Launched |
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Stepping Der CPU‑Stepping bezeichnet die interne Version eines Prozessormodells, die bei jeder neuen Fertigungsrunde geändert wird. Er gibt an, welche Revision des Chips verwendet wurde und kann Einfluss auf Leistung, Energieverbrauch oder Kompatibilität haben.
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R0 |
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Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
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SSE4.1,AVX 2.0,SSE4.2 |
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Tcase The highest temperature at which the product can safely operate without risk of damage or performance degradation. It is expressed in degrees Celsius and applies to all electronic components such as processors, servers, storage devices, and other hardware that generate heat during normal use.
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71 °C |
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Thermal design power The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.
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65 W |
| Thermal monitoring technologies | Yes |
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Thermal solution specification A short alphanumeric code that identifies the thermal solution or cooling configuration used in a computer component such as a processor, motherboard, or chassis. The identifier is typically assigned by the manufacturer and can be referenced to determine compatibility, performance characteristics, or warranty information for the cooling system.
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PCG 2015C |
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Video compression formats A list of video compression codecs that the product can encode or decode, such as H.264, H.265, VP9, M-JPEG, and others. Each value represents a codec that is natively supported by the device’s hardware or software.
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Yes |
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