Intel Dual Core i3-6100T 3.20 GHz Processor CPU

Intel (0735858305594 / BX80662I36100T) - Bandwidth: 8 MB/s - Box - ECC - Enhanced intel speedstep technology - Execute disable bit - Idle states - Intel 64 - Intel clear video technology - Intel enhanced halt state

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Intel Dual Core i3‑6100T 3.20 GHz Processor Overview

The Intel Core i3‑6100T is a sixth‑generation Skylake desktop processor designed for efficient, low‑power computing. Packaged in the compact LGA1151 (Socket H4) form factor, it delivers solid performance for everyday tasks while maintaining a modest thermal design power of 35 W. The processor is available as a boxed unit that includes an integrated cooler, making it ready to install in a wide range of desktop systems.

Key Architectural Features

Dual‑Core Design: Two physical cores with four logical threads via Hyper‑Threading technology.
Base Frequency: 3.20 GHz, providing responsive performance for multitasking and light workloads.
No Turbo Boost: The i3‑6100T is a base‑clock only model, ensuring predictable power consumption.
Smart Cache: 3 MB of shared L2/L3 cache optimizes data access for both cores.
Integrated Graphics: Intel® HD Graphics 530 supports DirectX 12.0 and OpenGL 4.4, with a maximum resolution of 4096×2304 on HDMI, DisplayPort, or eDP outputs.
Instruction Set Extensions: Supports SSE4.1, SSE4.2, AVX 2.0, AES‑NI, and Intel® Secure Key for enhanced security and performance.
Virtualization Support: VT‑x and VT‑d enable efficient virtualization environments.
Power Management: Enhanced SpeedStep, Idle States, and Thermal Monitoring technologies keep power usage low under idle or light loads.

Memory & I/O Capabilities

Supported Memory Types: DDR3L‑SDRAM (1333–2133 MHz) and DDR4‑SDRAM (1333–2133 MHz).
Maximum System Memory: Up to 64 GB, supported via dual‑channel architecture.
PCI Express Configuration: Supports up to 16 lanes in a 1×16 or 2×8 configuration (PCIe 3.0).
Bus Speed: DMI 3.0 at 8 GT/s, providing ample bandwidth for I/O devices.
Integrated Graphics Memory: Up to 1.74 GB of shared system memory for the HD 530 GPU.

Thermal and Power Profile

The processor’s thermal design power (TDP) is rated at 35 W, making it suitable for compact desktops, small form‑factor PCs, and energy‑efficient workstations. The included cooler in the boxed package ensures that the CPU stays within safe operating temperatures under typical workloads.

Use Cases and Performance Expectations

The i3‑6100T excels in environments where power efficiency and cost effectiveness are paramount:

Home Computing: Web browsing, document editing, media playback, and light photo/video editing.
Business Desktops: Office productivity suites, email clients, and virtualization of lightweight workloads.
Embedded Systems: Small form‑factor PCs for digital signage or kiosk applications where thermal constraints are critical.

Technical Specifications Summary

Feature	Specification
Processor Family	6th Generation Intel® Core™ i3 (Skylake)
Cores / Threads	2 / 4
Base Clock	3.20 GHz
Cache	3 MB Smart Cache (L2/L3)
TDP	35 W
Socket	LGA1151 (H4)
Integrated GPU	Intel® HD Graphics 530
Max GPU Memory	1.74 GB
Memory Types	DDR3L‑SDRAM, DDR4‑SDRAM
Memory Speed Support	1333–2133 MHz
Max System Memory	64 GB
PCIe Lanes	16 (1×16 or 2×8)
Bus Speed	DMI 3.0, 8 GT/s
Instruction Sets	SSE4.1, SSE4.2, AVX 2.0, AES‑NI, Intel® Secure Key
Virtualization	VT‑x, VT‑d
Power Management	Enhanced SpeedStep, Idle States, Thermal Monitoring

Conclusion

The Intel Core i3‑6100T 3.20 GHz offers a balanced combination of performance, efficiency, and integrated graphics capability in a small footprint. Its dual‑core architecture, modest TDP, and support for modern memory standards make it an ideal choice for budget‑conscious desktop builds that still require reliable multitasking and media handling.

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Tags	GHz Processor CPU Intel Dual Core i3-6100T
Identifiers
Brand	Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.
Model	Intel BX80662I36100T
MPN	Intel BX80662I36100T
ID	3861048
Dimensions / Weight
Key Features
Bandwidth The highest rate at which a device can transfer data, expressed as a frequency in hertz (Hz). It indicates the maximum throughput capability of the component or connection and allows comparison across similar products.	8 MB/s
Box Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.	Yes
Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.	DMI3
Bus type units The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.	GT/s
Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.	PC
Core name The designation of the processor core architecture or family, such as "Skylake", "Kaby Lake" or "Vishera". It identifies the specific micro‑architecture used in a CPU and helps users compare performance characteristics across different generations.	Skylake
CPUsocket type The physical connector used by a CPU to attach to a motherboard or compatible platform. It specifies the exact socket designation required for proper installation and compatibility, such as LGA 1151, Socket AM4, or LGA 1200.	LGA 1151
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.	Yes
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.	No
Enhanced intel speedstep technology	Yes
Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.	Yes
Generation The generation of a central‑processing unit indicates the cohort or family of CPU models that share common architecture, performance characteristics, and feature sets. It is typically expressed as an ordinal number (e.g., "1st Generation", "10th Gen") followed by the manufacturer name and model series, helping users compare processors across brands and time periods.	6th Generation
Graphics & IMC lithography The minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.	14 nm
Graphics output A list of the video output connectors and protocols that a device can provide for transmitting visual signals, such as HDMI, DisplayPort, VGA, or USB‑C based outputs. Each entry indicates a distinct connector type or version (e.g., "HDMI 2.1", "DP 1.4"). This attribute helps users identify which displays or external devices the product can support.	eDP/DP/HDMI/DVI
Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.	Yes
Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.	Yes
Intel clear video technology Indicates whether the product incorporates Intel’s Clear Video HD technology, a hardware feature that enhances video playback and capture quality by providing smoother motion, reduced artifacts, and improved color accuracy.	Yes
Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.	Yes
Intel Identity Protection Technology version Indicates the specific version number of Intel’s Identity Protection Technology that a product supports or implements. The value is typically a numeric string such as "1.00" or "0.00", representing the major and minor revision of the feature set.	1.00
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.	No
Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.	No
Intel TSX-NI version The specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by the processor, indicating its capability to handle transactional memory operations efficiently.	0.00
L2 cache The amount of internal memory reserved for a processor’s L2 cache, expressed as a pair of values: the number of banks and the capacity per bank (e.g., "4 x 256 KB"). This format allows specification of both the count of cache banks and the capacity of each bank, which together determine the total L2 cache available to the CPU.	3072 KB
Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.	Q3'15
Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.	DT
Maximum graphics adapter memory The amount of dedicated video memory available on a graphics adapter or GPU, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the GPU can store for textures, frame buffers and other rendering tasks, affecting performance in gaming, 3D applications and high‑resolution displays.	1740 MB
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.	64 GB
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed data channels that can be used simultaneously for peripherals such as graphics cards, storage controllers, and networking adapters.	16
Maximum on-board graphics adapter memory The maximum amount of dedicated video memory that the integrated graphics adapter built into a device can provide, expressed as a data size (e.g., megabytes or gigabytes). This value indicates how much graphical processing power is available for rendering, gaming, and other GPU‑intensive tasks.	1.74 GB
Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.	Dual-channel
Memory clock speeds supported by processor The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.	1333,1600,1866,2133 MHz
Memory types supported by processor A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.	DDR3L-SDRAM,DDR4-SDRAM
Memory voltage supported by processor The operating voltage required or supplied to the processor, expressed in volts (V). It indicates the electrical potential that powers the CPU and is essential for ensuring proper performance and compatibility with power delivery systems.	1.35 V
Number of Processors Supported The total count of CPU units that a computer system or component can accommodate or run simultaneously. It indicates how many separate processor chips are installed, supported by the motherboard or chassis, and is useful for understanding multi‑core or multi‑CPU configurations.	1
On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	Yes
On-board graphics adapter 4K support Indicates whether the device’s integrated graphics adapter can output a 4K resolution (3840×2160) image or video. A value of "Yes" means the hardware and drivers support 4K playback or rendering; "No" indicates that 4K is not supported.	Yes
On-board graphics adapter base frequency The clock speed at which the integrated graphics processor runs under normal conditions, expressed in hertz (Hz). It indicates how many cycles per second the GPU performs and is useful for comparing visual performance across devices that use an on‑board graphics solution.	350 MHz
On-board graphics adapter DirectX version The version number of the DirectX graphics API supported by a device, indicating its graphical capabilities and compatibility with software that relies on specific DirectX features.	12.0
On-board graphics adapter ID The unique identifier of the integrated graphics adapter built into a device, typically expressed as a hexadecimal string such as "0x5916" or a numeric code like "1916". This value allows users and systems to distinguish between different GPU models and versions across laptops, desktops, and motherboards.	1912
On-board graphics adapter model The model name or number of the integrated graphics adapter built into a device, such as a laptop or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	Intel® HD Graphics 530
On-board graphics adapter OpenGL version The specific version of the OpenGL graphics API supported by a device, indicating its rendering capabilities and compatibility with software that relies on this standard.	4.4
OpenGL support Indicates whether a product supports the OpenGL graphics API and, if so, which version is supported. The value can be "Yes" for basic support or a numeric string such as "4.5" or "4.6" to specify the exact OpenGL version available.	Yes
PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.	3.0
PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.	2x8,1x8+2x4,1x16
Processor ARK ID The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.	90734
Processor brand name The name of the company that designs and produces the central processing unit used in a device, such as Intel, AMD or Qualcomm. It identifies the manufacturer so users can quickly see which brand’s processors are supported by the product.	Intel Core i3 Intel Core i3 Processor
Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.	Smart Cache
Processor code A unique identifier that represents the specific model or variant of a computer processor. The code is typically an alphanumeric string (e.g., "SR2ZU", "SR3LA") used by manufacturers to distinguish between different CPU models, generations, and configurations. It can be entered as free text and may appear in product listings, technical specifications, or inventory records.	SR2HE
Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.	6th gen Intel® Core™ i3
Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.	3.2 GHz
Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.	Intel
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.	i3-6100T
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.	37.5 x 37.5 mm
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.	LGA 1151 (Socket H4)
Processor threads The number of independent execution units (threads) that a processor can handle simultaneously. This value indicates how many parallel tasks the CPU can process at once, which affects multitasking performance and workload distribution.	4
Product name The physical connector type used by a processor, motherboard or other component to interface with its platform, such as LGA1151, Socket AM4, LGA1200, etc. This attribute helps users determine compatibility between CPUs and motherboards.	Intel Core i3-6100T (3M Cache, 3.20 GHz)
Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.	Processor
Status	Discontinued
Stepping Der CPU‑Stepping bezeichnet die interne Version eines Prozessormodells, die bei jeder neuen Fertigungsrunde geändert wird. Er gibt an, welche Revision des Chips verwendet wurde und kann Einfluss auf Leistung, Energieverbrauch oder Kompatibilität haben.	S0
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.	SSE4.1,AVX 2.0,SSE4.2
Tcase Valor que indica la temperatura a la cual el producto opera o se mantiene durante su uso normal. Se expresa en grados Celsius, Fahrenheit o Kelvin según el contexto del fabricante y permite comparar condiciones térmicas entre dispositivos similares.	66 °C
Thermal design power The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.	35 W
Thermal monitoring technologies	Yes
Thermal solution specification A short alphanumeric code that identifies the thermal solution or cooling configuration used in a computer component such as a processor, motherboard, or chassis. The identifier is typically assigned by the manufacturer and can be referenced to determine compatibility, performance characteristics, or warranty information for the cooling system.	PCG 2015A
Video compression formats A list of video compression codecs that the product can encode or decode, such as H.264, H.265, VP9, M-JPEG, and others. Each value represents a codec that is natively supported by the device’s hardware or software.	Yes