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Intel INTEL BX8070110100F

Intel Core i3-10100F CPU with heatsink/fan in a retail box. Comet Lake quad core with 4.3GHz turbo, 65W thermal design power and 6MB cache. LGA 1200 socket compatibility

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Intel Core i3‑10100F Processor

The Intel Core i3‑10100F is a 10th‑generation desktop CPU built on the Comet Lake architecture. It delivers solid performance for everyday computing, light multitasking and entry‑level gaming while keeping power consumption low.

Key Specifications

  • Socket: LGA1200 (H5)
  • Cores / Threads: 4 cores, 8 threads
  • Base Frequency: 3.60 GHz
  • Turbo Boost Max: up to 4.30 GHz
  • Cache: 6 MB Smart Cache (L1: 256 KB, L2: 1 MB, L3: 6 MB)
  • Process Technology: 14 nm
  • TDP: 65 W
  • Integrated Graphics: None (requires a discrete GPU)
  • Memory Support: DDR4‑2666, dual‑channel, up to 128 GB
  • PCI Express: 3.0 x16, 1×8, 1×2 lanes available for expansion
  • Manufacturing Code: BX8070110100F

Architectural Highlights

The processor incorporates Intel’s Turbo Boost 2.0, allowing dynamic frequency scaling to meet workload demands. Hyper‑Threading doubles the logical core count, improving multitasking efficiency. The 14 nm process yields a balance of performance and thermal design power suitable for compact desktops.

Security & Virtualization Features

  • AES‑NI (Advanced Encryption Standard New Instructions) – hardware acceleration for encryption tasks.
  • Intel VT‑x and VT‑d – support for virtual machine execution and directed I/O virtualization.
  • Intel SGX (Software Guard Extensions) – secure enclaves for sensitive data processing.
  • Intel OS Guard & Secure Key – protection against firmware attacks.
  • Intel Optane Memory Supported – compatibility with high‑speed storage acceleration.

Connectivity & I/O

The CPU works in tandem with the Intel H510 chipset, providing:

  • Gigabit Ethernet (Intel I219‑V)
  • USB 3.0 x2 and USB 2.0 x1 ports via the motherboard
  • PCI Express 3.0 lanes for graphics cards, SSDs, or other expansion cards
  • Support for Intel® Wi‑Fi 5 (802.11ac) when paired with an appropriate module on the board.

Thermal Management

The 65 W TDP is managed by a standard stock cooler included in most boxed kits. The processor features Intel’s thermal monitoring technologies, enabling dynamic throttling to maintain safe operating temperatures under load.

Use Cases

  • Home and Office: Efficient handling of document editing, web browsing, and media consumption.
  • Light Gaming: With a discrete GPU, the CPU can support entry‑level titles at medium settings.
  • Content Creation: Adequate for photo editing and light video rendering when paired with sufficient RAM.
  • Virtualization: Hyper‑Threading and VT‑x make it suitable for running multiple virtual machines on a single workstation.

Compatibility & Installation Notes

When installing the Intel Core i3‑10100F, ensure the motherboard supports LGA1200 sockets and has the necessary BIOS update to recognize the 10th‑generation processor. The CPU does not include integrated graphics; a dedicated GPU is required for display output.

Summary

The Intel Core i3‑10100F delivers reliable performance for everyday tasks, light gaming, and basic content creation while maintaining low power consumption. Its robust set of security features, virtualization support, and efficient 14 nm architecture make it a versatile choice for modern desktop systems.


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Tags Intel Core i3 Comet Lake Intel i3 4 Core 3.6 GHz GHz 6 MB Smart Cache Box Intel INTEL BX8070110100F Intel Core i3-10100F Intel Core i3-10100F processor Intel Core I3-10100F Cpu Turbo Quad Core 6Mb Cach
Alternative searches AMD Ryzen 3 3100 AMD Ryzen 5 3600 AMD Ryzen 5 3600X AMD Ryzen 5 5600X AMD Ryzen 7 3700X AMD Ryzen 7 5800X AMD Ryzen 9 5900X Intel Core i3-10100 Intel Core i5-10400 Intel Core i7-10700 Intel Core i9-10900 Intel Core i3-10100F Intel Core i5-10400F Intel Core i5-10600K Intel Core i7-10700F Intel Core i7-10700K Intel Core i9-10900F Intel Core i9-10900K Intel Pentium Gold G6400
Identifiers
Brand Intel

Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.
MPN Intel BX8070110100F
ID 24703206
Dimensions / Weight
Key Features
Bus speed
The maximum theoretical speed at which the processor’s internal bus can transfer data, expressed in gigatransfers per second (GT/s). This value indicates the bandwidth capacity of the communication pathway between the CPU and other components such as memory or peripheral devices.
8 GT/s DMI
Cache
The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.
6 MB
Cooler Yes
CPU Brand
The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.
Intel
CPU Cores
The total count of physical processing units (cores) present in a central processing unit (CPU). This integer value indicates how many independent execution threads the CPU can handle simultaneously, influencing multitasking performance and computational throughput.
Quad Core
CPU Family
The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
Intel Core i3
CPU Socket
The physical connector used by a processor to attach to a motherboard or other compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.
Socket 1200
CPU Speed
The maximum operating frequency of a central processing unit (CPU), expressed in hertz (Hz). This value indicates how many cycles per second the CPU can execute under normal conditions and is useful for comparing performance potential across different models.
3.6 GHz
Dimensions
The pixel dimensions of a display or image, expressed as width by height (e.g., 1920x1080). It indicates how many pixels are used to render the visual content and is commonly used for monitors, TVs, smartphones, cameras, and digital images.
23 x 39 x 40cm (W x H x D)
Form factor
Specifies the physical configuration or design of a product, such as ATX, Micro‑ATX, Mini‑ITX, tower, case with cover, etc. It describes how the device is built and what mounting or expansion options it supports.
CPU
Graphics chipset
The exact model or designation of the graphics processing unit (GPU) installed in a device, such as "Intel UHD Graphics 620", "NVIDIA GeForce RTX 2070" or "AMD Radeon RX 580". It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
None
In stock
Indicates whether the product is a wire‑cut item (custom cut to size) or a stock item (pre‑cut to standard dimensions). This attribute helps buyers understand the manufacturing process and potential customization options.
Y
L1 Cache
The amount of internal memory reserved for a processor’s L1 cache, expressed in units such as kilobytes (KB), megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.
256 KB
L2 cache
The amount of internal memory reserved for a processor’s L2 cache, expressed as a pair of values: the number of banks and the capacity per bank (e.g., "4 x 256 KB"). This format allows specification of both the count of cache banks and the capacity of each bank, which together determine the total L2 cache available to the CPU.
1 MB
Memory
The amount of random‑access memory (RAM) physically installed in a device, expressed as a data size such as megabytes or gigabytes. It indicates how much information the system can hold for active processes and affects multitasking performance.
DDR4-2666
Number of cores
The total count of processing cores present in a CPU or GPU. This value indicates how many independent execution units are available for parallel processing, which can affect performance and multitasking capability.
4
Process Technology
The manufacturing process technology used to fabricate a processor, expressed in nanometers (nm). It indicates the size of the transistors and other features on the chip, which influences performance, power consumption, and integration density. The value is typically a numeric measurement such as 14 nm or 28 nm.
14nm
Processor generation
The generation of a processor indicates the cohort or family of CPU models that share common architecture, performance characteristics, and feature sets. It is typically expressed as a numeric ordinal (e.g., "1st Generation", "10th Gen") followed by the manufacturer name and model series. This attribute helps users compare processors across brands and time periods.
10th gen Intel® CoreT i3
Refresh rate
The number of times per second that a display updates its image, expressed in hertz (Hz). It indicates the smoothness and responsiveness of motion on the screen; higher rates generally provide a more fluid visual experience.
60Hz 2Ms Response Time
TDP
The maximum amount of heat generated by a computer component that the cooling system is designed to dissipate under normal operating conditions. It indicates the power consumption and thermal load the component can produce, helping users select appropriate cooling solutions and assess energy usage.
65W
Turbo speed
The maximum operating frequency reached by a processor when it enters turbo mode, expressed in hertz (Hz). It indicates the peak clock speed that can be achieved under high load, typically higher than the base frequency. This value helps users compare performance potential across different CPU models.
4.3 GHz

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