Intel Xeon E5-2697V3 Processor
Intel (5032037063760 / BX80644E52697V3) - Box - ECC - Enhanced intel speedstep technology - Execute disable bit - Idle states - Intel 64 - Intel Demand Based Switching - Intel trusted execution technology
Stores where to buy this product
Similar products
Intel Xeon E5-2697V3 Processor
The Intel Xeon E5‑2697V3 is a high‑performance server and workstation processor built on Intel’s Haswell architecture. Designed for demanding enterprise workloads, it delivers 14 physical cores, 28 threads, and a robust memory subsystem that supports up to 768 GB of DDR4 SDRAM.
Core Architecture & Performance
- Cores: 14
- Threads: 28 (Hyper‑Threading enabled)
- Base Frequency: 2.6 GHz
- Max Turbo Boost: 3.6 GHz
- Lithography: 22 nm
- Instruction Set Extensions: AVX‑2, Intel® Advanced Vector Extensions (AVX) 2.0
- 64‑bit Architecture: Supports Intel 64
- Cache: 35 MB Smart Cache (shared among all cores)
- Processor Family: Intel Xeon E5 v3 (E5‑2600 v3 series)
- Stepping: C1
- Launch Date: Q3 2014
Memory & I/O Subsystem
- Supported Memory Types: DDR4‑SDRAM
- Maximum Supported Memory: 768 GB (quad‑channel configuration)
- Memory Clock Speeds: 1600, 1866, 2133 MHz
- Memory Channels: Quad‑channel
- PCI Express Lanes: 40 total (2×20 per QPI link)
- PCI Express Configurations: x4, x8, x16 (Gen 3.0)
- Maximum PCIe Slots: 40 lanes available for expansion
- QPI Links: 2 (each operating at 9.6 GT/s)
- Bus Speed: 9.6 GT/s (QPI)
- System Bus Rate: 9.6 GT/s
Power Management & Thermal Features
- Tcase Temperature: 76.7 °C (maximum operating temperature)
- Voltage ID Range: 0.65 V – 1.3 V
- Enhanced Intel SpeedStep Technology: Yes
- Intel Demand Based Switching: Enabled
- Idle States (C‑States): Supported for power savings
- Execute Disable Bit: Present (NX bit)
- Thermal Monitoring Technologies: Included
Security & Reliability Enhancements
- ECC Memory Support: Yes (Error‑Correcting Code)
- Intel Trusted Execution Technology: Enabled
- Intel Secure Key Technology: Version 1.00
- Intel Identity Protection Technology: Version 0.00
- Execute Disable Bit (NX): Supported
- Intel TSX‑NI: Not supported (TSX‑NI version 0.00)
Package & Physical Characteristics
- Socket Type: LGA 2011‑v3
- Processor Package Size: 52.5 mm × 51 mm (approx.)
- Scalability: Dual‑socket (2S) configuration supported
- Package Type: BGA or LGA depending on OEM implementation
- Processor Brand Name: Intel Xeon v2
- Product Family: Intel Xeon Processor E5 v3 Family
- Component For: Server/Workstation platforms
Ideal Use Cases
The Intel Xeon E5‑2697V3 excels in environments that demand high core counts and large memory footprints. Typical applications include:
- Enterprise database servers (Oracle, SQL Server)
- Virtualized workloads (VMware ESXi, Hyper‑V) with heavy VM density
- High‑performance computing clusters for scientific simulations
- Large‑scale analytics and data warehousing platforms
- Content creation pipelines requiring parallel processing (video rendering, 3D modeling)
Key Takeaways
The combination of 14 cores, 28 threads, 35 MB Smart Cache, and support for up to 768 GB DDR4 memory positions the Intel Xeon E5‑2697V3 as a powerful workhorse for mission‑critical server deployments. Its robust security features, advanced power management, and dual‑socket scalability make it an enduring choice for enterprises seeking reliable performance without compromising on efficiency.
With its proven architecture and extensive feature set, the Intel Xeon E5‑2697V3 remains a cornerstone processor for high‑density server solutions that demand both speed and stability.
| This product in Comparor | |
|---|---|
|
Category
This product is cataloged in our store in these categories
|
|
|
International
Find this product in one of our international stores
|
|
| Colors
Predominant colors of the product |
|
| Identifiers | |
| Brand | ![]() Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company. |
| Model | Intel BX80644E52697V3 |
| MPN | Intel BX80644E52697V3 |
| ID | 4141634 |
| Dimensions / Weight | |
| Key Features | |
|
Box Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.
|
Yes |
|
Bus bandwidth The maximum frequency at which a system bus can transfer data, expressed in hertz (Hz). It indicates the theoretical throughput capability of the bus and allows users to compare performance across different processors or components.
|
9.6 |
|
Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
|
QPI |
|
Bus type units The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.
|
GT/s |
|
Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
|
Server/Workstation |
|
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
|
Yes |
|
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
|
No |
| Enhanced intel speedstep technology | Yes |
|
Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.
|
Yes |
|
Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.
|
Yes |
|
Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.
|
Yes |
|
Intel Demand Based Switching Indicates whether the product incorporates Intel’s Demand‑Based Switching technology, which dynamically adjusts power delivery to components based on workload demands, improving energy efficiency and performance.
|
Yes |
|
Intel flex memory access Indicates whether the product supports Intel’s flexible memory access feature, which allows dynamic allocation and sharing of memory resources between the CPU and other components to improve performance and power efficiency.
|
No |
|
Intel Identity Protection Technology version Indicates the specific version number of Intel’s Identity Protection Technology that a product supports or implements. The value is typically a numeric string such as "1.00" or "0.00", representing the major and minor revision of the feature set.
|
0.00 |
|
Intel Secure Key Technology version The specific version number of Intel Secure Key technology supported by the processor, indicating the generation and capabilities of the secure key feature set.
|
1.00 |
|
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.
|
Yes |
|
Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.
|
No |
|
Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.
|
Q3'14 |
|
Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
|
SRV |
|
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
|
786432 MB |
|
Maximum internal memory supported by processor The largest amount of internal random‑access memory (RAM) that a processor can address and support, expressed as a data size such as megabytes or gigabytes. It indicates the upper limit of memory capacity for active processes and multitasking performance on devices using this CPU.
|
768 GB |
|
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed data channels that can be used simultaneously for peripherals such as graphics cards, storage controllers, and networking adapters.
|
40 |
|
Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
|
Quad-channel |
|
Memory clock speeds supported by processor The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.
|
1600,1866,2133 MHz |
|
Memory types supported by processor A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.
|
DDR4-SDRAM |
|
Number of QPI links The total count of Quick Path Interconnect (QPI) connections present in a processor or motherboard. This value indicates how many QPI links are available for high‑speed communication between CPUs, memory controllers, or other components. It is a simple integer that helps users compare interconnect capabilities across different models.
|
2 |
|
PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.
|
3.0 |
|
PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.
|
x4, x8, x16 |
|
Processor ARK ID The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.
|
81059 |
|
Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
|
3.6 GHz |
|
Processor cache The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.
|
35 MB |
|
Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.
|
Smart Cache |
| Processor codename | Haswell |
|
Processor cores The total number of physical processing units in a single central processing unit (CPU). This value indicates how many independent tasks the CPU can handle simultaneously, influencing multitasking and parallel performance.
|
14 |
|
Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
|
Intel Xeon E5 v3 |
|
Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.
|
2.6 GHz |
|
Processor lithography The lithography process defines the minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.
|
22 nm |
|
Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.
|
Intel |
|
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
|
E5-2697V3 |
|
Processor operating modes The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute indicates the architectural mode(s) supported by the CPU and helps users determine compatibility with software that requires a specific bitness.
|
64-bit |
|
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
|
52.5 x 51 mm |
|
Processor series The processor series identifies the family or generation of a CPU, such as "Intel Xeon E5-2600" or "AMD Ryzen 5000". It is used to group models that share similar architecture, performance characteristics and compatibility features.
|
Intel Xeon E5-2600 v3 |
|
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.
|
LGA 2011-v3 |
|
Processor threads The number of independent execution units (threads) that a processor can handle simultaneously. This value indicates how many parallel tasks the CPU can process at once, which affects multitasking performance and workload distribution.
|
28 |
|
Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.
|
Processor |
| Status | Launched |
|
Stepping Der CPU‑Stepping bezeichnet die interne Version eines Prozessormodells, die bei jeder neuen Fertigungsrunde geändert wird. Er gibt an, welche Revision des Chips verwendet wurde und kann Einfluss auf Leistung, Energieverbrauch oder Kompatibilität haben.
|
C1 |
|
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
|
AVX 2.0 |
|
Tcase Valor que indica la temperatura a la cual el producto opera o se mantiene durante su uso normal. Se expresa en grados Celsius, Fahrenheit o Kelvin según el contexto del fabricante y permite comparar condiciones térmicas entre dispositivos similares.
|
76.7 °C |
| Thermal monitoring technologies | Yes |
|
VID voltage range The range of electrical voltage that a CPU can safely accept from its power source, expressed in volts (V). It indicates the minimum and maximum supply voltages compatible with the processor, covering both AC and DC inputs where applicable.
|
0.65 - 1.3 V |

