DL360 GEN10 XEON-G 6130 KIT

DL360 GEN10 XEON-G 6130 KIT

The DL360 GEN10 XEON-G 6130 KIT is a high‑performance server and workstation component designed to deliver exceptional compute power, scalability, and reliability. Built around the powerful Intel Xeon Gold 6130 processor, this kit integrates advanced features that enable demanding workloads such as virtualization, data analytics, and enterprise applications.

Processor Overview

The heart of the kit is the Intel Xeon Gold 6130, a 16‑core, 32‑thread processor based on the Skylake architecture. Manufactured using a 14 nm lithography process, it offers:

• Cores / Threads: 16 cores and 32 threads for parallel processing.
• Base Frequency: 2.10 GHz.
• Boost Frequency: Up to 3.7 GHz under optimal conditions.
• L3 Cache: 22 MB of high‑speed cache, facilitating rapid data access.
• Tcase: 87 °C (maximum case temperature).
• Thermal Design Power (TDP): 125 W, ensuring efficient heat dissipation.
• Instruction Sets: Supports AVX, AVX‑2.0, AVX‑512, SSE4.2, enabling advanced vector operations and improved performance for scientific computing and machine learning workloads.
• Operating Mode: 64‑bit architecture, compatible with modern operating systems and virtualization platforms.
• Socket: LGA 3647, a high‑pin-count socket that supports robust power delivery and signal integrity.
• Stepping: H0, indicating the latest revision for enhanced stability.
• Scalability: Supports up to 4 sockets (S), allowing multi‑processor configurations for extreme scalability.

Memory Support and Configuration

The processor supports a vast amount of memory, making it ideal for memory‑intensive applications:

• Maximum Internal Memory Supported: 786 432 MB (768 GB), enabling large in‑memory databases and high‑performance analytics.
• Memory Channels: Hexa‑channel architecture, providing six independent memory paths for maximum bandwidth.
• Supported Memory Types: DDR4‑SDRAM, the industry standard for high speed and low power consumption.
• Maximum Memory Clock Speed: 2666 MHz, ensuring rapid data transfer between CPU and RAM.

PCI Express Configuration

The kit offers extensive PCIe connectivity to accommodate a wide range of expansion cards:

• Maximum PCI Express Lanes: 48 lanes, allowing for multiple high‑bandwidth devices such as NVMe SSDs and GPUs.
• PCI Express Slots Version: 3.0, delivering up to 8 Gb/s per lane.
• Supported PCIe Configurations: The processor’s 48 lanes can be distributed across various slot configurations (x16, x8, x4) to match system design requirements.

Platform and Integration

The DL360 GEN10 XEON-G 6130 KIT is engineered for integration into the HPE ProLiant DL360 Gen10 chassis. This synergy ensures:

• Optimized Power Delivery: The LGA 3647 socket and 125 W TDP are matched to the chassis’s power modules.
• Efficient Cooling: The chassis provides advanced airflow management, keeping the processor within safe operating temperatures.
• Scalable Architecture: With support for up to four sockets, the kit can be deployed in single‑ or multi‑processor configurations, scaling performance linearly with additional CPUs.
• Enterprise Features: Compatibility with HPE’s management tools (such as iLO) and firmware updates ensures long‑term reliability and ease of administration.

Use Cases and Applications

This kit is tailored for environments that demand robust compute capabilities:

• Virtualization Platforms: Hyper‑visors like VMware ESXi or Microsoft Hyper‑V can run numerous virtual machines with high throughput.
• Data Analytics and Machine Learning: AVX‑512 support accelerates vectorized operations, reducing training times for large datasets.
• High‑Performance Computing (HPC): The combination of 16 cores, 32 threads, and extensive memory bandwidth makes it suitable for scientific simulations.
• Enterprise Applications: Database servers, ERP systems, and web services benefit from the processor’s low latency and high core count.

Key Takeaways

The DL360 GEN10 XEON-G 6130 KIT delivers:

• A powerful Intel Xeon Gold 6130 processor with 16 cores, 32 threads, and 22 MB L3 cache.
• Support for up to 768 GB of DDR4 memory, ensuring ample capacity for demanding workloads.
• Extensive PCIe connectivity (48 lanes, version 3.0) for high‑bandwidth expansion.
• Scalability to four sockets, enabling linear performance growth in multi‑CPU configurations.
• Compatibility with the HPE ProLiant DL360 Gen10 chassis, providing a cohesive and reliable platform.

Whether you are building a virtualized environment, running complex analytics, or deploying enterprise applications, this kit offers the performance, scalability, and reliability required for modern data centers and high‑performance workstations.