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Intel intel xeon sliver 4112

Name: Intel intel xeon sliver 4112
Brand: Intel
SKU: ID10603554
Availability: InStock

Intel (0735858343268 / BX806734112) - Box - ECC - Enhanced intel speedstep technology - Execute disable bit - Intel 64 - Intel trusted execution technology - Intel TSX-NI - Server/Workstation - Q3'17

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SponsoredBX806734112 Intel Xeon Silver 4112 4 Core 2.60GHz LGA 3647 8.25 MB L3 Processor

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Intel Xeon Silver 4112 – Powering Modern Server Workloads

The Intel Xeon Silver 4112 is a high‑performance server processor built on Intel’s 14 nm Skylake architecture. Designed for the enterprise, it delivers robust compute power, advanced memory support, and extensive scalability features that make it ideal for data centers, virtualization platforms, and demanding workstation environments.

Core Architecture & Performance

Processor Cores: 4 physical cores with 8 threads (Hyper‑Threading enabled)
Base Frequency: 2.6 GHz
Turbo Boost Frequency: up to 3.0 GHz (Intel® Turbo Boost Technology 2.0)
Instruction Set Support: AVX, AVX‑2.0, AVX‑512, SSE4.2 – enabling accelerated vector operations for scientific computing and machine learning workloads
64‑bit Architecture: Full Intel® 64 support for large address spaces and modern operating systems
Enhanced Intel SpeedStep Technology: Dynamic power management to balance performance with energy efficiency
Execute Disable Bit: Hardware protection against buffer overflow attacks
Intel Trusted Execution Technology: Secure enclave for sensitive data processing
Intel TSX‑NI (Transactional Synchronization Extensions): Version 1.00 – improves multi‑threaded performance by reducing lock contention

Memory & I/O Capabilities

Supported Memory Type: DDR4‑SDRAM (up to 2400 MHz)
Maximum Supported Memory: 768 GB per socket (2S scalability)
Memory Channels: Hexa‑channel configuration for high bandwidth and low latency
Maximum Internal Memory Capacity: 786,432 MB (768 GB) – ensuring ample space for large datasets
PCI Express Lanes: 48 lanes at PCIe 3.0, providing extensive connectivity for storage, networking, and accelerator cards
Maximum PCI Express Slots: 48, enabling dense server builds with multiple high‑speed devices

Thermal & Power Characteristics

TDP (Thermal Design Power): 85 W – optimized for efficient cooling in rack‑mount and blade servers
Package Size: 76 mm × 56.5 mm (LGA 3647)
Package Depth: 137 mm; Height: 112 mm; Width: 43 mm – compact footprint for dense server configurations
Tcase Temperature: 76 °C – reliable operation under sustained workloads

Scalability & Market Positioning

Scalable Architecture: Supports Intel’s 2‑socket (2S) server configurations, allowing linear performance scaling across multiple CPUs
Market Segment: Server/Workstation (SRV) – tailored for enterprise data centers and high‑end workstations requiring reliable compute resources
Launch Date: Q3 2017 – part of Intel’s 2017 Xeon Silver lineup, bringing modern features to existing server infrastructures

Key Technical Highlights

L3 Cache: 8.25 MB shared among all cores for rapid data access
Cache Size per Core: 8448 KB (L3)
Processor Code Name: Skylake – the same architecture that powers Intel’s latest desktop and mobile CPUs, ensuring proven performance and stability
Socket Compatibility: LGA 3647 – standard for high‑end server motherboards, enabling easy integration with existing platforms
Stepping: U0 – the final microcode revision for this processor family, guaranteeing optimal firmware support

Use Cases & Deployment Scenarios

The Intel Xeon Silver 4112 excels in environments that demand:

High core density with efficient power consumption – ideal for virtualized workloads and cloud infrastructure.
Large memory footprints and fast DDR4 bandwidth – perfect for database servers, analytics engines, and AI inference pipelines.
Robust I/O capabilities with 48 PCIe lanes – enabling multiple NVMe SSDs, high‑speed networking cards, or GPU accelerators in a single chassis.
Secure execution environments through Intel Trusted Execution Technology and Execute Disable Bit – essential for compliance‑heavy industries such as finance and healthcare.

Conclusion

The Intel Xeon Silver 4112 represents a balanced blend of performance, scalability, and efficiency. Its 4‑core, 8‑thread design, coupled with extensive memory support and high PCIe bandwidth, makes it a versatile choice for modern data centers and professional workstations that require reliable, secure, and high‑throughput processing capabilities.

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Identifiers
Brand	Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.
Model	Intel BX806734112
MPN	Intel BX806734112
ID	10603554
Dimensions / Weight
Key Features
Box Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.	Yes
Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.	Server/Workstation
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.	Yes
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.	No
Enhanced intel speedstep technology	Yes
Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.	Yes
Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.	Yes
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.	Yes
Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.	Yes
Intel TSX-NI version The specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by the processor, indicating its capability to handle transactional memory operations efficiently.	1.00
Intel Turbo Boost Max Technology 3.0 Indicates whether the processor supports Intel Turbo Boost Max Technology 3.0, a feature that dynamically selects the fastest cores for peak performance and improves efficiency during demanding workloads.	No
Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.	Q3'17
Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.	SRV
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.	786432 MB
Maximum internal memory supported by processor	768 GB
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed communication channels that can be used simultaneously for peripherals such as graphics cards, storage devices, and networking adapters.	48
Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.	Hexa-channel
Memory clock speeds supported by processor A list of the operating frequencies that a processor can run at, expressed in hertz (Hz). The values are typically given as MHz or GHz and may include multiple speeds separated by commas to indicate base, boost, or other supported clock rates. This attribute helps users compare the performance potential of different CPUs and understand the range of speeds they can achieve under various workloads.	2400 MHz
Memory types supported by processor	DDR4-SDRAM
On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.	No
Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.	137 mm
Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.	112 mm
Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.	43 mm
PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.	3.0
Processor ARK ID The unique numeric identifier assigned by Intel to each processor model, used for precise identification and lookup of technical specifications.	123551
Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.	3 GHz
Processor brand name The name of the company that designs and produces the central processing unit used in a device, such as Intel, AMD or Qualcomm. It identifies the manufacturer so users can quickly see which brand’s processors are supported by the product.	Intel Xeon Silver Intel Xeon Silver Processor
Processor cache The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.	8.25 MB
Processor codename	Skylake
Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.	Intel® Xeon®
Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.	2.6 GHz
Processor lithography The lithography process defines the minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.	14 nm
Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.	Intel
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.	4112
Processor operating modes The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute indicates the architectural mode(s) supported by the CPU and helps users determine compatibility with software that requires a specific bitness.	64-bit
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.	76.0 x 56.5 mm
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.	LGA 3647
Processor threads The number of independent execution units (threads) that a processor can handle simultaneously. This value indicates how many parallel tasks the CPU can process at once, which affects multitasking performance and workload distribution.	8
Product family The maximum clock frequency at which a processor operates, expressed in megahertz (MHz) or gigahertz (GHz). This value indicates the speed of the CPU and allows users to compare performance across different models.	Intel Xeon Processors
Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.	Processor
Scalability The maximum number of CPU sockets that a product can support. It indicates how many processor units can be installed simultaneously in the system, which affects overall processing capacity and scalability.	2S
Status	Launched
Stepping The processor stepping code identifies the specific revision of a CPU model, indicating changes in manufacturing that may affect performance, power consumption or compatibility. It is used to distinguish between different silicon revisions within the same product line.	U0
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.	AVX,AVX 2.0,AVX-512,SSE4.2
Tcase Valor que indica la temperatura a la cual el producto opera o se mantiene durante su uso normal. Se expresa en grados Celsius, Fahrenheit o Kelvin según el contexto del fabricante y permite comparar condiciones térmicas entre dispositivos similares.	76 °C