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Intel Xeon E3-1245 Processors BX80677E31245V6
Intel (0735858328128 / BX80677E31245V6) - Box - Cooler included - ECC - Enhanced intel speedstep technology - Execute disable bit - Idle states - Intel 64 - Intel clear video technology - Intel enhanced halt state
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SponsoredBX80677E31245V6 Intel Xeon E3-1245v6 4 Core 3.70GHz LGA 1151 8 MB L3 Processor
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Intel Xeon E3-1245 v6 Processor Overview
The Intel Xeon E3-1245 v6 is a high‑performance, quad‑core server and workstation CPU built on Intel’s 14 nm Kaby Lake architecture. Designed for the LGA1151 (Socket H4) platform, it delivers robust compute power, advanced security features, and versatile graphics capabilities in a compact package.
Key Architectural Highlights
- Cores & Threads: 4 physical cores with Hyper‑Threading, providing 8 logical threads for parallel workloads.
- Base Frequency: 3.70 GHz, with a turbo boost up to 4.10 GHz for burst performance.
- Lithography: 14 nm process technology, balancing power efficiency and density.
- Cache: 8 MB Smart Cache shared across all cores, enabling rapid data access.
- Instruction Set Support: AVX‑2.0, SSE4.1, SSE4.2 – ideal for scientific computing, media encoding, and virtualization.
Memory & Storage Interface
- Memory Channels: Dual‑channel DDR3L/DDR4 SDRAM support.
- Supported Memory Speeds: 1866 MHz and 2400 MHz, allowing flexible performance tuning.
- Maximum Supported RAM: Up to 64 GB (16 × 4 GB DIMMs) per processor.
- PCI Express Lanes: 16 lanes at PCIe 3.0, configurable as 1×16 or 2×8 for high‑bandwidth devices.
- DMI Interface: DMI 3.0 bus with an 8 GT/s transfer rate, ensuring fast communication between the CPU and chipset.
Integrated Graphics Capabilities
- Graphics Engine: Intel® HD Graphics P630 integrated GPU.
- Base Frequency: 350 MHz, dynamically scaling up to 1150 MHz under load.
- Maximum Resolution: Supports 4K (4096×2160) output via HDMI or DisplayPort.
- Display Outputs: DVI, HDMI, DP, and Embedded DisplayPort (eDP).
- DirectX Support: DirectX 12.0; OpenGL 4.4 – suitable for modern graphics workloads.
Power & Thermal Management
- TDP: 73 W, optimized for data‑center and workstation environments.
- Voltage Range (VID): 0.55–1.52 V, enabling fine‑grained power scaling.
- Thermal Monitoring: Intel Thermal Monitoring technologies provide real‑time temperature feedback.
- Cooler Included: Standard stock cooler supplied for immediate deployment.
Security & Reliability Features
- ECC Memory Support: Ensures data integrity in mission‑critical applications.
- Intel Secure Key Technology: Hardware random number generation for cryptographic operations.
- Intel Trusted Execution Technology (TXT): Enables secure boot and measured launch of virtual machines.
- Execute Disable Bit & Enhanced Halt State: Protects against buffer‑overrun attacks and reduces idle power consumption.
- TSX-NI (Transactional Synchronization Extensions – No Interlock): Provides hardware support for transactional memory, improving multi‑threaded performance.
Form Factor & Compatibility
- Package Size: 37.5 × 37.5 mm (LGA1151).
- Compatible Motherboards: Intel Server Board S1200SPLR and other LGA1151‑H4 platforms.
- Scalability: Single‑socket configuration, ideal for small to medium‑scale servers.
Use Cases & Applications
- Enterprise Servers: Virtualization hosts, database servers, and web application backends benefit from the processor’s balanced compute and memory bandwidth.
- Workstations: CAD, 3D rendering, video editing, and scientific simulations leverage the integrated GPU and high core count.
- Embedded Systems: The compact LGA1151 package and low TDP make it suitable for edge computing nodes that require reliable performance.
Conclusion
The Intel Xeon E3-1245 v6 stands out as a versatile, high‑performance CPU that blends powerful processing capabilities with advanced security and graphics features. Its 14 nm Kaby Lake core, dual‑channel memory support, and robust PCIe interface make it an excellent choice for both server and workstation deployments where reliability and scalability are paramount.
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| Identifiers | |
| Brand |  Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company. |
| Model | Intel BX80677E31245V6 |
| MPN | Intel BX80677E31245V6 |
| ID | 10603421 |
| Dimensions / Weight | |
| Key Features | |
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Box Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.
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Yes |
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Bus bandwidth The maximum frequency at which a system bus can transfer data, expressed in hertz (Hz). It indicates the theoretical throughput capability of the bus and allows users to compare performance across different processors or components.
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8 |
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Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
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DMI3 |
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Bus type units The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.
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GT/s |
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Compatibility A list of brand names, model numbers or product types that the item is compatible with. Each entry should be separated by commas to allow easy searching and comparison across products.
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Server Board S1200SPLR |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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Server/Workstation |
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Cooler included Indicates whether the product comes with a cooling solution included in its package. A value of "Yes" means a cooler (air, liquid, or passive) is supplied; a value of "No" means no cooler is provided and must be purchased separately.
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Yes |
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ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
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Yes |
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Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
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No |
| Enhanced intel speedstep technology | Yes |
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Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.
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Yes |
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Graphics output A list of the video output connectors and protocols that a device can provide for transmitting visual signals, such as HDMI, DisplayPort, VGA, or USB‑C based outputs. Each entry indicates a distinct connector type or version (e.g., "HDMI 2.1", "DP 1.4"). This attribute helps users identify which displays or external devices the product can support.
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eDP/DP/HDMI/DVI |
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Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.
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Yes |
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Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.
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Yes |
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Intel clear video technology Indicates whether the product incorporates Intel’s Clear Video HD technology, a hardware feature that enhances video playback and capture quality by providing smoother motion, reduced artifacts, and improved color accuracy.
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Yes |
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Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.
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Yes |
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Intel Secure Key Technology version The specific version number of Intel Secure Key technology supported by the processor, indicating the generation and capabilities of the secure key feature set.
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1.00 |
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Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.
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Yes |
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Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.
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Yes |
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Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.
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Q1'17 |
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Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
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SRV |
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Maximum graphics adapter memory The amount of dedicated video memory available on a graphics adapter or GPU, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the GPU can store for textures, frame buffers and other rendering tasks, affecting performance in gaming, 3D applications and high‑resolution displays.
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64 GB |
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Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
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65536 MB |
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Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed communication channels that can be used simultaneously for peripherals such as graphics cards, storage devices, and networking adapters.
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16 |
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Maximum on-board graphics adapter memory The maximum amount of dedicated video memory that the integrated graphics adapter built into a device can provide, expressed as a data size (e.g., megabytes or gigabytes). This value indicates how much graphical processing power is available for rendering, gaming, and other GPU‑intensive tasks.
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1.7 GB |
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Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
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Dual-channel |
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Memory clock speeds supported by processor The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.
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1866,2400 MHz |
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Memory types supported by processor A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.
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DDR3L-SDRAM,DDR4-SDRAM |
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On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
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Yes |
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On-board graphics adapter 4K support Indicates whether the device’s integrated graphics adapter can output a 4K resolution (3840×2160) image or video. A value of "Yes" means the hardware and drivers support 4K playback or rendering; "No" indicates that 4K is not supported.
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Yes |
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On-board graphics adapter base frequency The clock speed at which the integrated graphics processor runs under normal conditions, expressed in hertz (Hz). It indicates how many cycles per second the GPU performs and is useful for comparing visual performance across devices that use an on‑board graphics solution.
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350 MHz |
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On-board graphics adapter DirectX version The version number of the DirectX graphics API supported by a device, indicating its graphical capabilities and compatibility with software that relies on specific DirectX features.
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12.0 |
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On-board graphics adapter ID The unique identifier of the integrated graphics adapter built into a device, typically expressed as a hexadecimal string such as "0x5916" or a numeric code like "1916". This value allows users and systems to distinguish between different GPU models and versions across laptops, desktops, and motherboards.
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0x191D |
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On-board graphics adapter model The model name or number of the integrated graphics adapter built into a device, such as a laptop or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
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Intel® HD Graphics P630 |
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On-board graphics adapter OpenGL version The specific version of the OpenGL graphics API supported by a device, indicating its rendering capabilities and compatibility with software that relies on this standard.
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4.4 |
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Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.
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116 mm |
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Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.
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101 mm |
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Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.
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70 mm |
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PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.
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3.0 |
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PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.
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1x16,1x8+2x4,2x8 |
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Processor ARK ID The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.
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97473 |
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Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
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4.1 GHz |
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Processor brand name The name of the company that designs and produces the central processing unit used in a device, such as Intel, AMD or Qualcomm. It identifies the manufacturer so users can quickly see which brand’s processors are supported by the product.
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Intel Xeon |
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Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.
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Smart Cache |
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Processor code A unique identifier that represents the specific model or variant of a computer processor. The code is typically an alphanumeric string (e.g., "SR2ZU", "SR3LA") used by manufacturers to distinguish between different CPU models, generations, and configurations. It can be entered as free text and may appear in product listings, technical specifications, or inventory records.
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SR32B |
| Processor codename | Kaby Lake |
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Processor cores The total number of physical processing units in a single central processing unit (CPU). This value indicates how many independent tasks the CPU can handle simultaneously, influencing multitasking and parallel performance.
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4 |
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Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
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Intel® Xeon® E3 v6 |
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Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.
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3.7 GHz |
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Processor lithography The lithography process defines the minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.
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14 nm |
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Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.
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Intel |
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Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
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E3-1245 v6 |
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Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
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37.5 x 37.5 mm |
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Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.
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LGA 1151 (Socket H4) |
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Product family The maximum clock frequency at which a processor operates, expressed in megahertz (MHz) or gigahertz (GHz). This value indicates the speed of the CPU and allows users to compare performance across different models.
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Intel Xeon Processors |
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Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.
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Processor |
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Scalability The maximum number of CPU sockets that a product can support. It indicates how many processor units can be installed simultaneously in the system, which affects overall processing capacity and scalability.
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1S |
| Status | Launched |
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Stepping Der CPU‑Stepping bezeichnet die interne Version eines Prozessormodells, die bei jeder neuen Fertigungsrunde geändert wird. Er gibt an, welche Revision des Chips verwendet wurde und kann Einfluss auf Leistung, Energieverbrauch oder Kompatibilität haben.
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B0 |
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Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
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AVX 2.0,SSE4.1,SSE4.2 |
| Thermal monitoring technologies | Yes |
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VID voltage range The range of electrical voltage that a CPU can safely accept from its power source, expressed in volts (V). It indicates the minimum and maximum supply voltages compatible with the processor, covering both AC and DC inputs where applicable.
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0.55 - 1.52 V |
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