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Super Micro MBD-X11SSZ-F-O Network Server

Name: Super Micro MBD-X11SSZ-F-O Network Server
Brand: SUPER MICRO
SKU: ID1837513
Availability: InStock

SUPER MICRO (0672042195664 / X11SSZ-F-O) - Depth: 224 mm - DVI-I ports quantity: 1 - Number of COM connectors: 2 - Number of DIMM slots: 4 - USB 2.0 connectors: 6 - ECC - Ethernet LAN - Intel trusted execution technology

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SponsoredMB-X11SZF Supermicro X11SSZ-F Socket LGA 1151 Intel C236 Chipset Xeon E3-1200 v5/v6 Processors Support DDR4 4x DIMM 4x SATA3 6.0Gb/s Micro-ATX

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Super Micro MBD-X11SSZ-F-O Network Server Motherboard

The Super Micro MBD‑X11SSZ‑F‑O is a high‑performance, compact motherboard engineered for Intel Xeon E3‑1200 series processors. Designed in the Micro‑ATX form factor (224 mm × 224 mm), it delivers robust networking capabilities, advanced security features, and flexible storage options while maintaining a low thermal footprint of only 80 W.

Key Design Highlights

Form Factor: Micro‑ATX – ideal for small form‑factor servers and workstations.
Processor Socket: LGA 1151 (H4) – supports a single Intel Xeon E3‑1200 v5/v6 processor.
Chipset: Intel® C236 – provides enterprise‑grade features such as Intel Trusted Execution, AES New Instructions, and VT‑x virtualization.
Memory Support: 4 DIMM slots, DDR4‑SDRAM, up to 64 GB, with ECC or non‑ECC options. Supported speeds: 1600, 1866, 2133 MHz at 1.2 V.
Storage Interfaces: Four SATA III (6 Gb/s) connectors for HDD/SSD, supporting RAID levels 0, 1, 5, and 10.
Networking: Dual Gigabit Ethernet ports (RJ‑45), plus an IPMI LAN port for remote management.
Expansion Slots: One PCIe x16 Gen3 slot and two PCIe x4 Gen3 slots, enabling high‑bandwidth GPU or NIC add‑ons.
Security & Management: TPM 1.2 connector, Intel Trusted Execution Technology, Intel vPro™ Platform Eligibility, and IPMI support for out‑of‑band management.
USB Connectivity: Six USB 2.0 ports (including two front panel headers) and two USB 3.2 Gen 1 (formerly 3.0) ports.
Video Output: One DVI‑I port and one VGA (D‑Sub) port for legacy display support.

Performance & Reliability Features

The motherboard’s Intel C236 chipset integrates advanced power management, ensuring efficient operation even under heavy workloads. The 14 nm lithography process delivers low power consumption and high reliability. With support for ECC memory, the board is suitable for mission‑critical applications where data integrity is paramount.

The dual Gigabit Ethernet ports provide redundant network paths, enhancing throughput and fault tolerance. Combined with the IPMI LAN port, administrators can perform remote diagnostics, firmware updates, and power cycling without physical access to the server.

Storage & RAID Flexibility

Four SATA III connectors allow for a variety of storage configurations:

RAID 0: Striping across multiple drives for maximum performance.
RAID 1: Mirroring for data redundancy.
RAID 5: Parity‑based protection with efficient storage utilization.
RAID 10: Combination of mirroring and striping for both performance and reliability.

All RAID levels are supported through the Intel C236 chipset’s integrated RAID controller, eliminating the need for additional hardware.

Thermal & Environmental Specifications

Operating Temperature: 0 °C to 60 °C (ambient).
Storage Temperature: –20 °C to 60 °C.
Operating Humidity: 10 %–85 % RH.
Storage Humidity: 10 %–95 % RH.
Thermal Power: 80 W – suitable for low‑profile chassis with modest cooling solutions.

Compliance & Certifications

The board meets RoHS compliance, ensuring the absence of hazardous substances. It also supports Intel’s Trusted Platform Module (TPM) 1.2 for secure boot and encryption, aligning with enterprise security standards.

Ideal Use Cases

Enterprise Workstations: High‑performance computing with robust networking and storage options.
Small Business Servers: Reliable file sharing, backup, or virtualization hosts in a compact form factor.
Development & Testing Platforms: Flexible expansion slots for GPUs, NICs, or other peripherals.
Remote Management Environments: IPMI and dual Ethernet ports enable out‑of‑band control and redundancy.

Conclusion

The Super Micro MBD‑X11SSZ‑F‑O combines a powerful Intel C236 chipset, extensive connectivity, and enterprise‑grade security in a compact Micro‑ATX package. Its support for ECC memory, multiple RAID levels, dual Gigabit Ethernet, and IPMI management makes it an excellent foundation for building resilient, high‑performance servers or workstations that demand reliability, flexibility, and low power consumption.

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Category This product is cataloged in our store in these categories
International Find this product in one of our international stores	355.72 EUR 301.86 EUR
Colors Predominant colors of the product
Tags	Network server Network Server LGA1151 Network Server Intel C236 Network Server DDR4 4x Network Server SATA3 6.0Gb/s Network Server Xeon E3-1200 Network Server Micro-ATX Network Server Socket LGA1151 Network Server 4x DIMM Network Server Supermicro X11SSZ-F Network Server MBD-X11SSZ-F-O Network Server v5/v6 Processors
Identifiers
Brand	SUPER MICRO Supermicro is a brand of high-end servers and storage devices. The company is known for its high quality and reliability, as well as its innovative designs. Supermicro servers are used by some of the world's largest companies, and the brand is considered a top choice for data centers and other mission-critical applications.
Model	SUPER MICRO X11SSZ-F-O
MPN	SUPER MICRO X11SSZ-F-O
ID	1837513
Dimensions / Weight
Key Features
Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.	224 mm
DVI-I ports quantity Represents how many DVI‑I connectors are present on the product. The value is a simple integer indicating the total count of DVI‑I ports, regardless of version or configuration.	1
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.	Yes
Ethernet interface type A list of the Ethernet standards that a product supports, such as Fast Ethernet (10/100 Mbps), Gigabit Ethernet (1 Gbps), 2.5 GbE, 10 GbE, and other variants. Each value is a free‑text label describing one supported interface; multiple values are separated by commas when the device offers more than one speed or generation.	Fast Ethernet,Gigabit Ethernet
Ethernet LAN Indicates whether the product includes an Ethernet LAN interface for wired network connectivity, allowing data transmission over RJ‑45 or compatible cables.	Yes
Ethernet LAN ports Represents the total count of Ethernet LAN (RJ‑45) interfaces available on a product. The value is an integer indicating how many physical Ethernet ports are present, regardless of speed or generation.	2
HDD interface List of the physical interface(s) used by a hard drive together with the number of bays it occupies, such as "2 x SATA (2 x Bay)" or "1 x M.2 PCIe". This attribute helps users determine both the connection type and how many drives can be installed in an enclosure or system.	Serial ATA III
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.	Yes
Intel Virtualization Technology Indicates whether the product supports Intel’s virtualization technology, which enables efficient execution of virtual machines by providing hardware‑assisted features such as VT‑x and VT‑d for CPU instruction set extensions.	VT-x
Intel Xeon series The specific model identifier of an Intel Xeon processor, such as E5‑2600 or E3‑1200. This value allows users to determine compatibility with motherboards, operating systems, and other hardware components.	E3-1200
Lithography The minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor or GPU.	14 nm
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.	64 GB
Memory voltage The electrical voltage required by the RAM modules of a device, expressed in volts (V). It indicates the operating supply voltage that the memory needs to function correctly and safely.	1.2 V
Motherboard chipset The model of the motherboard’s chipset, indicating the family of supported processors and integrated features such as I/O interfaces, memory support, and peripheral connectivity.	Intel® C236
Motherboard form factor The physical layout and size classification of a motherboard, such as ATX, Micro‑ATX, Mini‑ITX, or other standardized formats. It indicates the dimensions, mounting points, and expansion capabilities that determine compatibility with computer cases and components.	Micro ATX
Non-ECC Indicates whether the memory module does not support error‑correcting code (ECC). A value of Yes means the module lacks ECC protection, while No means it includes ECC functionality.	Yes
Number of DIMM slots The count of physical memory slots available on a device for installing RAM modules. It indicates how many separate memory sticks can be installed or upgraded.	4
Operating relative humidity The range of relative humidity (in percentage) within which the product is designed to operate reliably. Values are expressed as a minimum–maximum interval such as "20 - 80 %" and indicate the acceptable environmental moisture level for optimal performance.	10 - 85%
Operating temperature The range of temperatures in which a product can safely operate without risk of damage or performance degradation. Values are expressed in degrees Celsius (°C) and may represent a single temperature, a minimum–maximum interval, or an average operating point.	0 - 60 °C
Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.	Intel
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.	LGA 1151 (Socket H4)
RAID levels A comma‑separated list that specifies the RAID configurations supported by a storage controller or device. Each entry can be a numeric level (e.g., 0, 1, 5, 10) or a special label such as JBOD. This attribute indicates which disk arrangements the system can manage.	0,1,5,10
RAID support A comma‑separated list of RAID levels that a storage device or controller can support, such as 0, 1, 5, 10, JBOD, and other proprietary configurations. Each value represents a distinct RAID mode the system is capable of creating or managing.	Yes
RoHS compliance Indicates whether the product is manufactured in accordance with the RoHS (Restriction of Hazardous Substances) directive, which limits the use of certain hazardous materials in electrical and electronic equipment.	Yes
Storage relative humidity The range of relative humidity (expressed as a percentage) within which the storage device is designed to operate reliably. Values are given as a minimum–maximum interval such as "10 - 90 %" and indicate the acceptable environmental moisture level for optimal performance.	10 - 95%
Storage temperature The range of temperatures in which a device can safely operate without risk of damage or performance degradation. Values are expressed in degrees Celsius (°C) and may represent a single temperature, a minimum–maximum interval, or an average operating point.	-20 - 60 °C
Supported DIMM module capacities A list of memory module sizes that the product can support, expressed as data sizes such as megabytes or gigabytes. Each value represents a single capacity option; multiple options are separated by commas.	4GB,8GB,16GB
Supported memory clock speeds The operating frequencies that a processor or memory module can run at, expressed in megahertz (MHz) or gigahertz (GHz). This attribute lists all supported clock rates, allowing users to understand the performance range of the component.	1600,1866,2133 MHz
Thermal power The amount of electrical power, expressed in watts (W), that a device consumes or is designed to dissipate as heat during normal operation. It represents the typical energy draw of the product and can be used to estimate operating costs, compare efficiency, or assess cooling requirements.	80 W
TPM connector Indicates whether the product includes a physical port that can accept a Trusted Platform Module (TPM) chip, enabling hardware‑based security features such as secure boot and encrypted storage.	Yes
USB 2.0 connectors The total number of physical USB 2.0 ports available on a product. This value indicates how many separate USB 2.0 interfaces can be used for connecting peripherals such as keyboards, mice, storage devices or other accessories.	6
Wi-Fi Indicates whether the product has built‑in Wi‑Fi capability, allowing it to connect to wireless networks without requiring external adapters or dongles.	No